pcf2123 NXP Semiconductors, pcf2123 Datasheet - Page 52
pcf2123
Manufacturer Part Number
pcf2123
Description
Spi Real Time Clock/calendar
Manufacturer
NXP Semiconductors
Datasheet
1.PCF2123.pdf
(54 pages)
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NXP Semiconductors
19. Abbreviations
20. Revision history
Table 50.
PCF2123_1
Product data sheet
Document ID
PCF2123_1
Revision history
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 49.
Acronym
CMOS
BCD
FFC
HBM
LSB
MM
MOS
MSB
MSL
PCB
RTC
SMD
SPI
Fig 34. Temperature profiles for large and small components
Release date
20081119
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Complementary Metal Oxide Semiconductor
Binary Coded Decimal
Film Frame Carrier
Human Body Model
Least Significant Bit
Machine Model
Metal Oxide Semiconductor
Most Significant Bit
Moisture Sensitivity Level
Printed-Circuit Board
Real Time Clock
Surface Mount Device
Serial Peripheral Interface
Data sheet status
Product data sheet
Rev. 01 — 19 November 2008
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Change notice
-
SPI Real time clock/calendar
temperature
peak
Supersedes
-
PCF2123
© NXP B.V. 2008. All rights reserved.
001aac844
time
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