tda8001t NXP Semiconductors, tda8001t Datasheet
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DATA SHEET TDA8001 Smart card interface Product specification Supersedes data of 1995 Feb 01 File under Integrated Circuits, IC02 INTEGRATED CIRCUITS 1996 Dec 12 ...
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... Easy chaining for multiple card readers ISO 7816 compatibility. ORDERING INFORMATION TYPE NUMBER NAME TDA8001; DIP28 TDA8001A TDA8001T; SO28 TDA8001AT 1996 Dec 12 APPLICATIONS Pay TV (multistandards conditional access system, videoguard, newscript) Multi-application smart card readers (banking, vending machine, electronic payment identification). GENERAL DESCRIPTION ...
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... V maximum load capacitor 150 nF PP TDA8001 +70 C; amb see Fig.10 TDA8001T +70 C; amb see Fig.11 3 Product specification TDA8001 MIN. TYP. MAX. 6 4.5 4. ...
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Philips Semiconductors Smart card interface BLOCK DIAGRAM handbook, full pagewidth ALARM ALARM I/O( C) RSTIN OFF DETECT CMDVCC CMD7 GND2 CMD3.5 CLKOUT2 VPP12.5 VPP15 VPP21 1996 Dec 12 V SUP V DD DELAY VOLTAGE 18 SUPERVISOR ...
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... Philips Semiconductors Smart card interface PINNING PIN SYMBOL TDA8001 TDA8001A TDA8001T TDA8001AT XTAL 1 DETECT 2 I/O 3 RST 4 CLK 5 VPP12.5 6 n.c. VPP15 7 n.c. PRES 8 PRES n. GND1 SUP DELAY 16 ALARM 17 ALARM 18 OFF 19 CMDVCC 20 VPP21 21 n.c. CVNC 22 CMD3 CDMTC CLKOUT2 ...
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... Philips Semiconductors Smart card interface handbook, halfpage 1 XTAL DETECT 2 I/O 3 RST 4 CLK 5 VPP12.5 6 VPP15 7 TDA8001 TDA8001T PRES 8 PRES GND1 MBH811 Fig.2 Pin configuration. 1996 Dec 12 handbook, halfpage 28 I/ CMD7 or CDMS RSTIN 26 25 GND2 24 CLKOUT2 23 CMD3.5 or CDMTC ...
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Philips Semiconductors Smart card interface FUNCTIONAL DESCRIPTION Power supply The circuit operates within a supply voltage range of 6 and GND are the supply pins. All card DD contacts remain inactive during power up or down. ...
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Philips Semiconductors Smart card interface R EAD MODE When the activation sequence is completed and, after the card has replied its Answer-to-Reset, the TDA8001 will be in the READ mode. Data is exchanged between the card and the microcontroller via ...
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Philips Semiconductors Smart card interface handbook, full pagewidth CDMS CDMTC XTAL ENCLK QF CLK 1996 Dec 12 ENCLK QCA CK Q ...
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Philips Semiconductors Smart card interface handbook, full pagewidth PDOWN handbook, full pagewidth OFF PRES DETECT CMDVCC VEILLE (INTERNAL) INTERNAL CLOCK CMD3.5 CLK ENRST (INTERNAL) RSTIN RST 1996 Dec 12 ACTIVATION IDLE FAULT DEACTIVATION Fig.6 State ...
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Philips Semiconductors Smart card interface handbook, full pagewidth CMDVCC VEILLE (INTERNAL) INTERNAL CLOCK CMD3.5 CLK ENRST (INTERNAL) RSTIN RST handbook, full pagewidth PRES DETECT CMDVCC VEILLE (INTERNAL) INTERNAL CLOCK CMD3.5 ...
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... SUP DD CVNC 12 Product specification CONDITIONS MIN. 0 duration TDA8001 +70 C; note 1; amb see Fig.10 TDA8001T +70 C; note 1; amb see Fig. PP(read TDA8001 MAX. UNIT 18 ...
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Philips Semiconductors Smart card interface 4 handbook, halfpage P tot ( Fig.10 Power derating curve (DIP28). HANDLING Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 ...
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Philips Semiconductors Smart card interface CHARACTERISTICS SUP SYMBOL PARAMETER Supply V supply voltage DD I supply current DD V threshold voltage for power-on th1 reset ...
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Philips Semiconductors Smart card interface SYMBOL PARAMETER I HIGH level input current IH Reset output to the card (RST) V output voltage in IDLE IDLE V LOW level output voltage OL V HIGH level output voltage OH t delay between ...
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Philips Semiconductors Smart card interface SYMBOL PARAMETER Card supply voltage ( output voltage CC I output current CC SR slew rate 5 V reference output voltage (CVNC) V output voltage at pin CVNC CVNC I output current ...
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Philips Semiconductors Smart card interface SYMBOL PARAMETER V voltage on pin I/O outside a IDLE session Z impedance on pin I/O( C) IDLE outside a session R internal pull-up resistance pu between pin I/O and rise ...
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Philips Semiconductors Smart card interface INTERNAL PIN CONFIGURATION handbook, full pagewidth XTAL 100 A DETECT I 100 RST CLK 20 VPP12.5 VPP15 as VPP12.5 PRES as VPP12.5 PRES as VPP12.5 V ...
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Philips Semiconductors Smart card interface APPLICATION INFORMATION 5 V handbook, full pagewidth to 8805 micro- controller 80C52 MICRO- GND CONTROLLER GND (1) The capacitor should be placed as close as ...
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Philips Semiconductors Smart card interface PACKAGE OUTLINES DIP28: plastic dual in-line package; 28 leads (600 mil) handbook, full pagewidth pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions ...
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Philips Semiconductors Smart card interface SO28: plastic small outline package; 28 leads; body width 7 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...
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Philips Semiconductors Smart card interface SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is ...
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Philips Semiconductors Smart card interface DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data ...
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Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. + ...