xc7318 Xilinx Corp., xc7318 Datasheet

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xc7318

Manufacturer Part Number
xc7318
Description
Xc7300 Cmos Epld Family ,
Manufacturer
Xilinx Corp.
Datasheet

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Part Number:
XC7318
Manufacturer:
XILINX
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xc7318-5PC44C
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The XC7300 Family
Features
• High-performance Erasable Programmable Logic
• Advanced Dual-Block architecture
• 100% interconnect matrix
• High-speed arithmetic carry network
• Multiple independent clocks
• Each input programmable as direct, latched, or
• High-drive 24 mA output
• I/O operation at 3.3 V or 5 V
• Meets JEDEC Standard (8-1A) for 3.3 V 0.3 V
• Power management options
• Multiple security bits for design protection
• Supported by industry standard design and verification
• 100% PCI compliant
Devices (EPLDs)
– 5 / 7.5 ns pin-to-pin speeds on all fast inputs
– Up to 167 MHz maximum clock frequency
– Fast Function Blocks
– High-Density Function Blocks
– 1 ns ripple-carry delay per bit
– 43 to 61 MHz 18-bit accumulators
registered
tools
(XC7354, XC7372, XC73108, XC73144)
Typical 22V10 Equivalent
Number of Macrocells
Number of Function Blocks
Number of Flip-Flops
Number of Fast Inputs
Number of Signal Pins
This document was created with FrameMaker 4 0 2
XC7318
1.5 – 2
18
18
12
38
2
XC7336
3 – 4
36
36
12
38
4
2-1
Product Description
XC7300 CMOS EPLD Family
Description
The XC7300 family employs a unique Dual-Block architec-
ture, which provides high speed operations via Fast Func-
tion Blocks and/or high density capability via High Density
Function Blocks.
Fast Function Blocks (FFBs) provide fast, pin-to-pin
speed and logic throughput for critical decoding and ultra-
fast state machine applications. High-Density Function
Blocks (FBs) provide maximum logic density and system-
level features to implement complex functions with pre-
dictable timing for adders and accumulators, wide func-
tions and state machines requiring large numbers of
product terms, and other forms of complex logic.
In addition, the XC7300 architecture employs the Univer-
sal Interconnect Matrix (UIM) which guarantees 100%
interconnect of all internal functions. This interconnect
scheme provides constant, short interconnect delays for
all routing paths through the UIM. Constant interconnect
delays simplify device timing and guarantee design perfor-
mance, regardless of logic placement within the chip.
All XC7300 devices are designed in 0.8 CMOS EPROM
technology.
All XC7300 EPLDs include programmable power manage-
ment features to specify high-performance or low-power
operation on an individual Macrocell-by-Macrocell basis.
Unused Macrocells are automatically turned off to mini-
XC7354
108
54
12
58
6
6
XC7372
126
72
12
84
8
8
XC73108
108
198
120
12
12
12
XC73144
144
276
156
16
16
12

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xc7318 Summary of contents

Page 1

... All XC7300 devices are designed in 0.8 CMOS EPROM technology. All XC7300 EPLDs include programmable power manage- ment features to specify high-performance or low-power operation on an individual Macrocell-by-Macrocell basis. Unused Macrocells are automatically turned off to mini- XC7318 XC7336 XC7354 1.5 – – ...

Page 2

XC7300 EPLD Family Output I/O Block Figure 1. XC7300 Device Block Diagram mize power dissipation. Designers can operate speed-criti- cal paths at maximum performance, while non-critical paths dissipate less power. Xilinx development software supports XC7300 EPLD design using third-party schematic ...

Page 3

... UIM 9 from FFB Macrocell 9 Feedback 5 Private P-Terms per Macrocell Feedback to UIM Pin Feedback to UIM Figure 2. Fast Function Block and Macrocell Schematic for the XC7318, XC7336, and XC73144 2 Global 2 Fast OE AND Array 12 from Fast 12 Input Pins 24 3 Inputs from UIM 9 from FFB ...

Page 4

... Each Fast Function Block output is capable of sinking 24 mA when volts. These include all outputs on CCIO the XC7318 and XC7336 devices and all Fast Outputs (FOs) on the XC7354, XC7372, XC73108, and XC73144 devices. Unlike other I/Os, the Fast Function Block inputs do not have an input register ...

Page 5

AND Array 21 Inputs from UIM 3 from Fast Input Pins (FI) 12 Sharable 5 Private P-Terms per P-Terms per Function Block Macrocell More Macrocells Shift-In from Previous MC Shift-Out to Next ...

Page 6

... Fast Input Pins Only) Input and I/O Pins Only Figure 7. Input/Output Schematic (except XC7318/XC7336 which do not include I/O flip-flops) Each UIM input can be programmed to connect to any UIM output. The delay through the interconnect matrix is con- stant, regardless of the routing distance, fan-out, or fan-in. ...

Page 7

... Output buffers, except those connected to Fast Function Blocks, can sink 12 mA when V CCIO Block outputs can sink 24 mA when V puts on the XC7318 and XC7336 devices connect to FFBs. Outputs listed as Fast Outputs (FO) on the XC7354, XC7372, XC73108 and XC73144 devices con- nect to FFBs. ...

Page 8

XC7300 EPLD can be exposed to without damage is 7000 W • s/cm 2 mately one week at 12,000 W/cm Design Recommendations For proper operation, all unused input and I/O pins must be connected to a ...

Page 9

XC7300 EPLD Family t FOE FOE t I, I/O IN Input Register t SUIN t HIN t CE SUCEIN t HCEIN t COIN FAST t IN INPUT FCLK Figure 8. XC7300 Timing Model Synchronous Clock Switching Characteristics F Pin CLK ...

Page 10

Combinatorial Switching Characteristics Input, I/O Pin UIM Delay Logic Delay P-Term Assignment Delay Transparent Register Delay Output Buffer Output Pin Asynchronous Clock Switching Characteristics Input, I/O Pin t IN Input, I/O Delay UIM Delay Clock at Register Data from Logic ...

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