tea1094t NXP Semiconductors, tea1094t Datasheet

no-image

tea1094t

Manufacturer Part Number
tea1094t
Description
Hands Free Ic
Manufacturer
NXP Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TEA1094T
Manufacturer:
NXPL
Quantity:
5 510
Part Number:
tea1094t/C2
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Company:
Part Number:
tea1094t/C3
Quantity:
1 740
Part Number:
tea1094tC
Manufacturer:
NXP
Quantity:
5 510
Part Number:
tea1094tC
Quantity:
5 510
Part Number:
tea1094tC1
Manufacturer:
NXPL
Quantity:
5 510
Part Number:
tea1094tC1
Quantity:
5 510
Product specification
Supersedes data of 1996 Mar 11
File under Integrated Circuits, IC03
DATA SHEET
TEA1094; TEA1094A
Hands free IC
INTEGRATED CIRCUITS
1996 Jul 15

Related parts for tea1094t

tea1094t Summary of contents

Page 1

DATA SHEET TEA1094; TEA1094A Hands free IC Product specification Supersedes data of 1996 Mar 11 File under Integrated Circuits, IC03 INTEGRATED CIRCUITS 1996 Jul 15 ...

Page 2

... ORDERING INFORMATION TYPE NUMBER NAME TEA1094 DIP28 TEA1094A DIP24 TEA1094T SO28 TEA1094AT SO24 TEA1094AM SSOP24 1996 Jul 15 APPLICATIONS Mains, battery or line-powered telephone sets with hands-free/listening-in functions Cordless telephones Answering machines Fax machines ...

Page 3

Philips Semiconductors Hands free IC QUICK REFERENCE DATA kHz GND measured in test circuit of Fig.12; unless otherwise specified. SYMBOL PARAMETER V supply voltage BB I current ...

Page 4

Philips Semiconductors Hands free IC BLOCK DIAGRAM handbook, full pagewidth 10 ( (13) ( (15) MUTET 22 C MIC (18) MIC R MIC 28 R TSEN (24) TSEN C TSEN 27 (23) TENV C ...

Page 5

Philips Semiconductors Hands free IC PINNING PINS SYMBOL TEA1094 TEA1094A DLC/MUTER 1 RIN1 2 RIN2 3 n.c. 4 GAR 5 LSP 6 n.c. 7 GND 8 n. VOL 11 SWR 12 STAB 13 SWT 14 n.c. ...

Page 6

Philips Semiconductors Hands free IC handbook, halfpage DLC/MUTER 1 RIN1 2 RIN2 3 n.c. 4 GAR 5 LSP 6 n.c. 7 TEA1094 GND 8 n. VOL 11 SWR 12 STAB 13 SWT 14 MGE434 Fig.2 Pin ...

Page 7

Philips Semiconductors Hands free IC handbook, full pagewidth telephone line sidetone Supply: pins V , GND and PD BB The TEA1094 and TEA1094A must be supplied with an external stabilized voltage source between pins V GND. In the idle mode, ...

Page 8

Philips Semiconductors Hands free IC handbook, full pagewidth 19 MUTET (15 MIC MIC 22 (18) R MIC envelope detector The pin numbers given in parenthesis refer to the TEA1094A. Loudspeaker channel handbook, full pagewidth 5 R GAR ...

Page 9

Philips Semiconductors Hands free RIN1, RIN2, GAR OUDSPEAKER AMPLIFIER PINS The TEA1094 and TEA1094A have symmetrical inputs for the loudspeaker amplifier with an input resistance between RIN1 and RIN2 ( The ...

Page 10

Philips Semiconductors Hands free IC To determine the noise level, the signals on TENV and RENV are buffered to TNOI and RNOI. These buffers have a maximum source current and a maximum sink current of 120 A. ...

Page 11

Philips Semiconductors Hands free IDT SWT ECISION LOGIC PINS AND handbook, full pagewidth 27 (23) TENV TNOI 26 (22) ATTENUATOR 24 (20) RENV RNOI 23 (19) 19 (15) MUTET from dynamic limiter The pin numbers given in ...

Page 12

Philips Semiconductors Hands free IC As can be seen from Fig.9, the output of the decision logic is a current source. The logic table gives the relationship between the inputs and the value of the current source. It can charge ...

Page 13

... V , RIN1 and RIN2 BB V maximum voltage on pins RIN1 and RIN2 RIN(max) V maximum voltage on pin V BB(max) P total power dissipation tot TEA1094 TEA1094A TEA1094T TEA1094AT TEA1094AM T IC storage temperature stg T operating ambient temperature amb 1996 Jul 15 idle mode Tx mode Rx mode G vtx G vrx ...

Page 14

... Philips Semiconductors Hands free IC THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to ambient in free air th j-a TEA1094 TEA1094A TEA1094T TEA1094AT TEA1094AM CHARACTERISTICS kHz GND measured in test circuit of Fig.12; unless otherwise specified. SYMBOL PARAMETER Supply (V , GND and PD) ...

Page 15

Philips Semiconductors Hands free IC SYMBOL PARAMETER T MUTET RANSMIT MUTE INPUT V LOW level input voltage IL V HIGH level input voltage IH I input current MUTET G voltage gain reduction with vtxm MUTET active Loudspeaker channel (RIN1, RIN2, ...

Page 16

Philips Semiconductors Hands free IC SYMBOL PARAMETER D YNAMIC LIMITER t attack time when V att release time when V rel from THD ...

Page 17

Philips Semiconductors Hands free IC SYMBOL PARAMETER N OISE ENVELOPE DETECTORS I maximum current sourced from source(NOI) pins TNOI or RNOI I maximum current sunk by sink(NOI) pins TNOI or RNOI V voltage difference between NOI pins RNOI and TNOI ...

Page 18

Philips Semiconductors Hands free IC handbook, full pagewidth 20 (16) MOUT R GAT C GAT 30 (17) GAT 2 C RIN1 (2) RIN1 220 RIN2 (3) RIN2 220 nF 18 (14) MICGND 8 (6) GND ...

Page 19

R1 620 MIC R GAT 100 nF C GAT C8 MIC 100 nF QR TEA106x C1 line 100 SLPE R9 20 The pin numbers given in parenthesis refer to the TEA1094A. (1) TEA1094A ...

Page 20

C1 100 F tip MICRO- CONTROLLER DP DTMF ring interrupter The pin numbers given in parenthesis refer to the TEA1094A. (1) TEA1094A only. R1 620 100 C7a S1 20 100 nF MIC 2.2 k ...

Page 21

Philips Semiconductors Hands free IC PACKAGE OUTLINES DIP28: plastic dual in-line package; 28 leads (600 mil) handbook, full pagewidth pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions ...

Page 22

Philips Semiconductors Hands free IC DIP24: plastic dual in-line package; 24 leads (600 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...

Page 23

Philips Semiconductors Hands free IC SO28: plastic small outline package; 28 leads; body width 7 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 24

Philips Semiconductors Hands free IC SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 25

Philips Semiconductors Hands free IC SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. ...

Page 26

Philips Semiconductors Hands free IC SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is ...

Page 27

Philips Semiconductors Hands free IC DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data ...

Page 28

Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. + ...

Related keywords