mk50x256cmb100 Freescale Semiconductor, Inc, mk50x256cmb100 Datasheet - Page 2

• Manufacturer Part Number: mk50x256cmb100
• Description: Arm Cortex-m4 Core With Dsp
• Manufacturer: Freescale Semiconductor, Inc

1 Ordering parts...........................................................................4
2 Part identification......................................................................4
3 Terminology and guidelines......................................................5
4 Ratings......................................................................................9
5 General.....................................................................................11
6 Peripheral operating requirements and behaviors....................20
2
1.1 Determining valid orderable parts......................................4
2.1 Description.........................................................................4
2.2 Format...............................................................................4
2.3 Fields.................................................................................4
2.4 Example............................................................................5
3.1 Definition: Operating requirement......................................5
3.2 Definition: Operating behavior...........................................6
3.3 Definition: Attribute............................................................6
3.4 Definition: Rating...............................................................7
3.5 Result of exceeding a rating..............................................7
3.6 Relationship between ratings and operating
3.7 Guidelines for ratings and operating requirements............8
3.8 Definition: Typical value.....................................................8
3.9 Typical value conditions....................................................9
4.1 Thermal handling ratings...................................................10
4.2 Moisture handling ratings..................................................10
4.3 ESD handling ratings.........................................................10
4.4 Voltage and current operating ratings...............................10
5.1 Nonswitching electrical specifications...............................11
5.2 Switching specifications.....................................................18
5.3 Thermal specifications.......................................................20
requirements......................................................................7
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
5.1.6
5.1.7
5.1.8
5.2.1
5.2.2
5.3.1
5.3.2
Voltage and current operating requirements.........11
LVD and POR operating requirements.................12
Voltage and current operating behaviors..............13
Power mode transition operating behaviors..........13
Power consumption operating behaviors..............14
EMC radiated emissions operating behaviors.......17
Designing with radiated emissions in mind...........18
Capacitance attributes..........................................18
Device clock specifications...................................18
General switching specifications...........................19
Thermal operating requirements...........................20
Thermal attributes.................................................20
K50 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Table of Contents
Preliminary
7 Dimensions...............................................................................64
8 Pinout........................................................................................64
6.1 Core modules....................................................................21
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.4 Memories and memory interfaces.....................................30
6.5 Security and integrity modules..........................................38
6.6 Analog...............................................................................38
6.7 Timers................................................................................56
6.8 Communication interfaces.................................................57
6.9 Human-machine interfaces (HMI)......................................63
7.1 Obtaining package dimensions.........................................64
8.1 K50 Signal Multiplexing and Pin Assignments..................65
8.2 K50 Pinouts.......................................................................69
6.1.1
6.1.2
6.3.1
6.3.2
6.3.3
6.4.1
6.4.2
6.4.3
6.6.1
6.6.2
6.6.3
6.6.4
6.6.5
6.6.6
6.6.7
6.8.1
6.8.2
6.8.3
6.8.4
6.8.5
6.8.6
6.8.7
6.8.8
6.9.1
Debug trace timing specifications.........................21
JTAG electricals....................................................21
MCG specifications...............................................25
Oscillator electrical specifications.........................27
32kHz Oscillator Electrical Characteristics............29
Flash (FTFL) electrical specifications....................30
EzPort Switching Specifications............................34
Flexbus Switching Specifications..........................35
ADC electrical specifications.................................38
CMP and 6-bit DAC electrical specifications.........46
12-bit DAC electrical characteristics.....................49
Op-amp electrical specifications...........................52
Transimpedance amplifier electrical
specifications — full range....................................53
Transimpedance amplifier electrical
specifications — limited range..............................54
Voltage reference electrical specifications............55
USB electrical specifications.................................57
USB DCD electrical specifications........................57
USB VREG electrical specifications......................57
DSPI switching specifications (low-speed mode)..58
DSPI switching specifications (high-speed mode) 59
I2C switching specifications..................................61
UART switching specifications..............................61
I2S switching specifications..................................61
TSI electrical specifications...................................63
Freescale Semiconductor, Inc.