at24c128 ATMEL Corporation, at24c128 Datasheet
at24c128
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at24c128 Summary of contents
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... Die Sales: Wafer Form, Waffle Pack, and Bumped Wafers Description The AT24C128/256 provides 131,072/262,144 bits of serial electrically erasable and programmable read only memory (EEPROM) organized as 16,384/32,768 words of 8 bits each. The device’s cascadable feature allows devices to share a common Two-wire bus ...
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... Storage Temperature ....................................–65° +150° C Voltage on Any Pin with Respect to Ground .................................... –1.0V to +7.0V Maximum Operating Voltage .......................................... 6.25V DC Output Current........................................................ 5.0 mA Figure 1. Block Diagram AT24C128/256 2 *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent dam- age to the device. This is a stress rating only and ...
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... If the pin is left floating, the WP pin will be internally pulled down to GND if the capacitive coupling to the circuit board V necting the pin to GND. Memory AT24C128/256, 128K/256K SERIAL EEPROM: The 128K/256K is internally organized as 256/512 pages of 64-bytes each. Random word addressing requires a 14/15-bit data word Organization address. ...
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... V max are reference only and are not tested The AT24C128/256 bearing the process letter “B” on the package (the mark is located in the lower right corner on the top- side of the package) are approved for operation in the extended temperature range. AT24C128/256 4 = 25° ...
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... Input rise and fall times: ≤ Input and output timing reference voltages: 0 The Write Cycle Time only applies to the AT24C128/256 devices bearing the process letter “B” on the package (the mark is located in the lower right corner on the top side of the package). ...
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... The AT24C128/256 bearing the process letter “B” in the package (the mark is located in the lower right corner on the top side of the package), guarantees 1 million write cycle endurance (1.8 – 3.6V). 5. The AT24C128/256 bearing the process letter “B” on the package (the mark is located in the lower right corner on the top- side of the package) are approved for operation in the extended temperature range. ...
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... EEPROM in 8-bit words. The EEPROM sends a zero during the ninth clock cycle to acknowl- edge that it has received each word. STANDBY MODE: The AT24C128/256 features a low power standby mode which is enabled: a) upon power-up and b) after the receipt of the STOP bit and the completion of any internal operations ...
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... Figure 3. Write Cycle Timing (SCL: Serial Clock, SDA: Serial Data I/O) SCL SDA 8th BIT WORDn Note: 1. The write cycle time t is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. WR AT24C128/256 8 ® ) ACK t wr STOP CONDITION (1) ...
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... Figure 4. Data Validity Figure 5. Start and Stop Definition Figure 6. Output Acknowledge 0670T–SEEPR–3/07 AT24C128/256 9 ...
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... Upon a compare of the device address, the EEPROM will output a zero compare is not made, the device will return to a standby state. DATA SECURITY: The AT24C128/256 has a hardware data protection scheme that allows the user to write protect the whole memory when the WP pin ...
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... The sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see Figure 12 on page 12). Figure 7. Device Address Figure 8. Byte Write 0670T–SEEPR–3/07 AT24C128/256 11 ...
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... Figure 9. Page Write Notes: Figure 10. Current Address Read Figure 11. Random Read Notes: Figure 12. Sequential Read AT24C128/256 DON’T CARE bit) († = DON’T CARE bit for the 128K DON’T CARE bit) († = DON’T CARE bit for the 128K) 0670T–SEEPR–3/07 ...
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... AT24C128-W1.8-11 Notes: 1. This device is not recommended for new design. Please refer to AT24C128B datasheet. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics tables. 2. “U” designates Green package + RoHS compliant. 3. Available in waffle pack and wafer form; order as SL788 for wafer form. Bumped die available upon request. Please contact Serial EEPROM Marketing ...
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... Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP) 8Y4 8-lead, 6. 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP) 8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) –2.7 Low-voltage (2.7V to 5.5V) –1.8 Low-voltage (1.8V to 3.6V) AT24C128/256 14 (1) Package 8P3 8P3 8S1 8S1 8S2 ...
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... Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 2325 Orchard Parkway San Jose, CA 95131 R 0670T–SEEPR–3/ TITLE 8P3, 8-lead, 0.300" Wide Body, Plastic Dual In-line Package (PDIP) AT24C128/256 End View COMMON DIMENSIONS (Unit of Measure = inches) MIN NOM MAX SYMBOL A 0.210 A2 0.115 0.130 ...
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... JEDEC SOIC Top View e Side View Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R AT24C128/256 TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing ...
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... Values b and C apply to pb/Sn solder plated terminal. The standard thickness of the solder layer shall be 0.010 +0.010/−0.005 mm. 2325 Orchard Parkway San Jose, CA 95131 R 0670T–SEEPR–3/ ∅ End View TITLE 8S2, 8-lead, 0.209" Body, Plastic Small Outline Package (EIAJ) AT24C128/256 E1 L COMMON DIMENSIONS (Unit of Measure = mm) MIN MAX SYMBOL NOM A 1.70 2.16 A1 0.05 0. ...
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... A1 BALL PAD CORNER e (e1) 1. This drawing is for general information only. 2. Dimension ‘b’ is measured at the maximum solder ball diameter. 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R AT24C128/256 Top View A1 BALL PAD CORNER (d1) Bottom View ...
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... San Jose, CA 95131 R 0670T–SEEPR–3/ End View A SYMBOL TITLE 8Y1, 8-lead (4.90 x 3.00 mm Body) MSOP Array Package (MAP) Y1 AT24C128/256 PIN 1 INDEX AREA Bottom View COMMON DIMENSIONS (Unit of Measure = mm) MIN NOM ...
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... Colorado Springs, CO 80906 R 0670T–SEEPR–3/07 A PIN COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN A – A1 0.00 D 5.80 E 4.70 D1 2.85 E1 2. 0.50 TITLE 8Y4, 8-lead (6.00 x 4.90 mm Body) SOIC Array Package (SAP) Y4 AT24C128/256 NOM MAX NOTE – 0.90 – 0.05 6.00 6.20 4.90 5.10 3.00 3.15 3.00 3.15 0.40 0.45 1.27 TYP 3.81 REF 0.60 0.70 DRAWING NO. 8Y4 5/24/04 REV ...
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... Dimension D and determined at Datum Plane H. 2325 Orchard Parkway San Jose, CA 95131 R 0670T–SEEPR–3/ TITLE 8A2, 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) AT24C128/256 L1 L End View COMMON DIMENSIONS (Unit of Measure = mm) MIN SYMBOL NOM MAX NOTE D 2 ...
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... AT24C128/256 22 Doc. Rev. Date Comments 0670T 3/2007 Added note ‘Not recommended for new design’ to AT24C128 0670S 5/2006 Implemented Revision History page; Added Note 1 “Not recommended for new design; please refer to AT24C256B datasheet” to AT24C256 part on Pages 1 and 14 0670T–SEEPR–3/07 ...
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... Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. © 2007 Atmel Corporation. All rights reserved. Atmel trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. Atmel Operations Memory ...