cp2400-c-gdi Silicon Laboratories, cp2400-c-gdi Datasheet
cp2400-c-gdi
Related parts for cp2400-c-gdi
cp2400-c-gdi Summary of contents
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... Full Technical Data Sheet - CP2400/1/2/3 20 MHz Internal smaRTClock Oscillator SPI 2 x 16-bit GPIO Expander Timers OR 256 Byte LCD Controller SRAM Copyright © 2011 by Silicon Laboratories CP2400-C-GDI interface (SMBus/I C device 2 C device only) places Optional 32.768 kHz Digital I/O LCD CP2400-C-GDI ...
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... CP2400-C-GDI 1. Ordering Information Table 1.1. Product Selection Guide 1,2 CP2400-GDI 20 Notes: 1. See “SPI Bonding Information” on page 7. 2. See “SMBus/I2C Bonding Information” on page 10. 2 256 Rev. 1 Tested Die in Wafer Form ...
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... Pin Definitions Table 2.1 lists the pin definitions for the CP2400-C-GDI. Table 2.1. Pin Definitions for the CP2400-C-GDI Name Physical Pad Type Number SPI SMBus XTAL1 XTAL2 Out Power In 1.8–3.6 V Power Supply Voltage Input. DD GND ...
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... CP2400-C-GDI Table 2.1. Pin Definitions for the CP2400-C-GDI (Continued) Name Physical Pad Type Number SPI SMBus SMBA0 — I/O LCD0 A Out P0 I/O LCD1 A Out P0 I/O LCD2 A Out P0 I/O LCD3 A Out P0 I/O LCD4 A Out P0 I/O LCD5 A Out P0 I/O LCD6 A Out P0 ...
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... Table 2.1. Pin Definitions for the CP2400-C-GDI (Continued) Name Physical Pad Type Number SPI SMBus P1 I/O LCD15 A Out P2 I/O LCD16 A Out P2 I/O LCD17 A Out P2 I/O LCD18 A Out P2 I/O LCD19 A Out P2 I/O LCD20 A Out P2 I/O LCD21 A Out P2 I/O LCD22 A Out P2 ...
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... CP2400-C-GDI Table 2.1. Pin Definitions for the CP2400-C-GDI (Continued) Name Physical Pad Type Number SPI SMBus P3 I/O LCD31 A Out P4 I/O COM0 A Out P4 I/O COM1 A Out P4 I/O COM2 A Out P4 I/O COM3 A Out 6 Description Bit 7, Port 3 Bit 0, Port 4 Bit 1, Port 4 ...
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... Reserved* 28 Reserved* 29 Reserved* *Note: Pins marked “Reserved” should not be connected. CP2400-C-GDI Package Pin Name Physical Pad X (µm) CAP –858.75 XTAL1 –858.75 XTAL2 –858.75 VDD –858.75 GND –858.75 GND –858.75 P4.3/COM3 –858.75 P4.2/COM2 –858.75 P4.1/COM1 – ...
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... CP2400-C-GDI Table 3.1. SPI Bonding Pad Coordinates (Relative to Center of Die) (Continued) Physical Pad Example Package Number Pin Number (QFN-48) 30 Reserved GND 44 Reserved ...
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... Figure 3.1. Example Die Bonding (QFN-48) for SPI CP2400-C-GDI Rev. 1 ...
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... CP2400-C-GDI 2 3.2. SMBus/I C Bonding Information 2 Table 3.2. SMBus/I C Bonding Pad Coordinates (Relative to Center of Die) Physical Pad Example Number Package Pin Number (QFP-48 ...
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... Reserved GND *Note: Pins marked “Reserved” should not be connected. CP2400-C-GDI Physical Pad X (µm) — 858.75 P1.7/LCD15 858.75 P1.6/LCD14 858.75 P1.5/LCD13 858.75 P1.4/LCD12 858.75 P1.3/LCD11 858.75 P1.2/LCD10 858.75 P1.1/LCD9 858.75 P1.0/LCD8 858.75 P0 ...
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... CP2400-C-GDI Figure 3.2. Example Die Bonding (QFP-48) for SMBus Rev. 1.0 C ...
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... Maximum Processing Temperature Electronic Die Map Format Bond Pad Pitch Minimum *Note: This is the Expected Known Good Die yielded per wafer and represents the batch order quantity (one wafer). Rev. 1.0 CP2400-C-GDI CP2401C mil ±1 mil Notch 80 µm ...
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... CP2400-C-GDI 4. Wafer Storage Guidelines It is necessary to conform to appropriate wafer storage practices to avoid product degradation or contami- nation. Wafers may be stored for months in the original packaging supplied by Silicon Labs. Wafers must be stored at a temperature of 18–24 °C. Wafers must be stored in a humidity-controlled environment with a relative humidity of <30%. ...
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... N : OTES CP2400-C-GDI Rev. 1.0 15 ...
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... CP2400-C-GDI C I ONTACT NFORMATION Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 Tel: 1+(512) 416-8500 Fax: 1+(512) 416-9669 Toll Free: 1+(877) 444-3032 Please visit the Silicon Labs Technical Support web page: https://www.silabs.com/support/pages/contacttechnicalsupport.aspx ...