lpc1810 NXP Semiconductors, lpc1810 Datasheet - Page 80

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lpc1810

Manufacturer Part Number
lpc1810
Description
Lpc1850/30/20/10 32-bit Arm Cortex-m3 Mcu; Up To 200 Kb Sram; Ethernet, Two High-speed Usb, Lcd, And External Memory Controller
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
LPC1850_30_20_10
Objective data sheet
13.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
accordingly to the increase in parasitics of the PCB layout.
All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 17 February 2011
x1
and C
32-bit ARM Cortex-M3 microcontroller
LPC1850/30/20/10
x2
should be chosen smaller
x1
, C
x2
, and C
© NXP B.V. 2011. All rights reserved.
x3
in case of
80 of 87

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