c8051f912-gdi Silicon Laboratories, c8051f912-gdi Datasheet - Page 9

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c8051f912-gdi

Manufacturer Part Number
c8051f912-gdi
Description
Manufacturer
Silicon Laboratories
Datasheet
C8051F912-GDI
Table 3.2. Wafer and Die Information
Wafer ID
C8051F911B
Wafer Dimensions
8 in.
Die Dimensions
1.9256 mm x 2.0366 mm
Wafer Thickness
12 mil ±1 mil
Wafer Identification
Notch
Scribe Line Width
80 µm
Die per Wafer*
Contact Sales for info
Passivation
Standard
Wafer Packaging Detail
Wafer crisper
Bond Pad Dimensions
60 µm x 60 µm
Maximum Processing Temperature
250 °C
Electronic Die Map Format
.txt
Bond Pad Pitch Minimum
142 µm
*Note: This is the Expected Known Good Die yielded per wafer and
represents the batch order quantity (one wafer).
Rev. 1.0
9

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