s71ws256n Meet Spansion Inc., s71ws256n Datasheet

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s71ws256n

Manufacturer Part Number
s71ws256n
Description
Stacked Multi-chip Product Mcp
Manufacturer
Meet Spansion Inc.
Datasheet

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S71WS-N
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM
Data Sheet (Advance Information)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Publication Number S71WS-N_00
Notice On Data Sheet Designations
Revision A
Amendment 6
for definitions.
Issue Date July 19, 2006
S71WS-N Cover Sheet

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s71ws256n Summary of contents

Page 1

S71WS-N Stacked Multi-Chip Product (MCP) 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory with CellularRAM Data Sheet (Advance Information) Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be ...

Page 2

Notice On Data Sheet Designations Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all ...

Page 3

... T Package – 11.6 mm Operating Temperature – Wireless, –25° +85° S71WS128NB0 Document S29WS-N Revision A Amendment 6 pSRAM 64 Mb 128 Mb S71WS128NC0 S71WS256NC0 S71WS256ND0 S71WS512NC0 S71WS512ND0 Publication Identification Number (PID) S29WS-N_00 Cellram_04 Cellram_06 Cellram_07 Issue Date July 19, 2006 ...

Page 4

... Product Selector Guide Device Numbers S71WS128NB0 S71WS128NC0 S71WS256NC0 S71WS256ND0 S71WS512NC0 S71WS512ND0 Note: 0 (Protected), 1 (Unprotected [Default State pSRAM pSRAM Flash Speed Model Density Speed Flash (Mb) (MHz) (MHz WS128N ...

Page 5

... Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations. S71WS128N S71WS256N S71WS512N Package Marking Note: The package marking omits the leading S from the ordering part number. ...

Page 6

Input/Output Descriptions Table 3.1 identifies the input and output package connections provided on the device. Symbol A23-A0 Address inputs DQ15-DQ0 Data input/output OE# Output Enable input. Asynchronous relative to CLK for the Burst mode. WE# Write Enable input. V ...

Page 7

MCP Block Diagram F-VCC Flash-only Address Shared Address CLK WP# ACC ( Not e 2) F1-CE# OE# WE# F-RST# AVD# F2-CE# ( Note 2) R-VCC R-CE1# R-UB# R-LB# R-CE2 ( ...

Page 8

... J2 R-CE1# K2 RFU L2 RFU M1 DNU Notes MCPs based on a single S29WS256N (S71WS256N), ball B5 is RFU. In MCP's based on two S29WS256N (S71WS512), ball B5 is F2-CE#. 2. Addresses are shared between Flash and RAM depending on the density of the pSRAM. MCP S71WS128NB0 S71WS128NC0 S71WS256NC0 S71WS256ND0 S71WS512NC0 S71WS512ND0 ...

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5.2.2 Look-Ahead Pinout for Future Designs Please refer to the Design-in Scalable Wireless Solutions with Spansion Products application note (publication number: Design_Scalable_Wireless_A0_E). Contact your local Spansion sales representative for more details. ...

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FTA084—84-ball Fine-Pitch Ball Grid Array (FBGA) 11.6 x 8.0 x 1.4 mm 0.15 C (2X) INDEX MARK PIN A1 CORNER 84X 0. 0. PACKAGE FTA 084 JEDEC N/A D ...

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5.3.3 TSD084—84-ball Fine-Pitch Ball Grid Array (FBGA) 12.0 x 9.0 x 1.2 mm 0.15 C (2X) INDEX MARK PIN A1 CORNER 84X 0. 0.08 ...

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FEA084—84-ball Fine-Pitch Ball Grid Array (FBGA) 12.0 x 9.0 x 1.4 mm 0.15 C (2X) INDEX MARK PIN A1 CORNER 84X 0.15 M 0.08 M PACKAGE FEA 084 JEDEC N ...

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Revision History Section Revision A (February 1, 2004) Initial release. Revision A1 (February 9, 2005) Updated document to include Burst Speed of 66 MHz Global Updated Publication Number Revision A2 ...

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