k4t51043qb-gce6 Samsung Semiconductor, Inc., k4t51043qb-gce6 Datasheet - Page 7

• Manufacturer Part Number: k4t51043qb-gce6
• Description: 512mb B-die Ddr2 Sdram
• Manufacturer: Samsung Semiconductor, Inc.

512Mb B-die DDR2 SDRAM
2. Package Pinout/Mechnical Dimension & Addressing
2.1 Package Pinout
Notes:
B1, B9, D1, D9 = NC for x4 organization.
Pins B3 has identical capacitance as pins B7.
VDDL and VSSDL are power and ground for the DLL. It is recommended that they are isolated on the device from
VDD, VDDQ, VSS, and VSSQ.
Ball Locations (x4)
x4 package pinout (Top View) : 60ball FBGA Package
VDDQ
VDD
VDDL
VDD
NC
VSS
1
NC
NC
G
A
B
C
D
E
H
K
F
J
L
Top View (See the balls through the Package)
+
+
+
+
1
VSSQ
DQ1
VSSQ
VREF
CKE
2
BA0
A10
A12
NC
A3
A7
2
+ : Depopulated Ball
3
: Populated Ball
VDDQ
VSS
DQ3
VSS
DM
BA1
WE
NC
A1
A5
A9
3
+
+
+
+
+
+
+
+
+
+
+
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4
A
B
C
D
G
H
K
E
F
J
L
+
+
+
+
+
+
+
+
+
+
+
5
7
VSSDL
VDDQ
VSSQ
DQ2
DQS
RAS
CAS
+
+
+
+
+
+
+
+
+
+
+
A11
NC
A2
A6
6
8
7
VSSQ
VSSQ
DQS
DQ0
CK
CK
A13
CS
A0
A4
A8
8
9
+
+
+
VDDQ
VDDQ
9
VDD
ODT
VSS
VDD
NC
NC
Rev. 0.91 (Sep. 2003)
DDR2 SDRAM
Preliminary