gs8321e36e-250i GSI Technology, gs8321e36e-250i Datasheet

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gs8321e36e-250i

Manufacturer Part Number
gs8321e36e-250i
Description
2m X 18, 1m X 32, 1m X 36 36mb Sync Burst Srams
Manufacturer
GSI Technology
Datasheet
165-Bump FP-BGA
Commercial Temp
Industrial Temp
Features
• FT pin for user-configurable flow through or pipeline
• Dual Cycle Deselect (DCD) operation
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 165-bump FP-BGA package
• RoHS-compliant 165-bump BGA package available
Functional Description
Applications
The GS8321E18/32/36E is a 37,748,736-bit high performance
synchronous SRAM with a 2-bit burst address counter.
Although of a type originally developed for Level 2 Cache
applications supporting high performance CPUs, the device
now finds application in synchronous SRAM applications,
ranging from DSP main store to networking chip set support.
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV) and write control inputs (Bx,
BW, GW) are synchronous and are controlled by a positive-
edge-triggered clock input (CK). Output enable (G) and power
down control (ZZ) are asynchronous inputs. Burst cycles can
be initiated with either ADSP or ADSC inputs. In Burst mode,
subsequent burst addresses are generated internally and are
controlled by ADV. The burst address counter may be
configured to count in either linear or interleave order with the
Rev: 1.05 12/2007
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
operation
Through
Pipeline
3-1-1-1
2-1-1-1
Flow
2M x 18, 1M x 32, 1M x 36
36Mb Sync Burst SRAMs
Curr
Curr
Curr
Curr
tCycle
tCycle
t
t
(x32/x36)
(x32/x36)
KQ
KQ
(x18)
(x18)
Parameter Synopsis
1/35
-250 -225 -200 -166 -150 -133 Unit
285
330
205
235
2.5
4.0
5.5
5.5
250
290
195
225
2.7
4.4
6.0
6.0
Linear Burst Order (LBO) input. The Burst function need not
be used. New addresses can be loaded on every cycle with no
degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by
the user via the FT mode pin (Pin 14). Holding the FT mode
pin low places the RAM in Flow Through mode, causing
output data to bypass the Data Output Register. Holding FT
high places the RAM in Pipeline mode, activating the rising-
edge-triggered Data Output Register.
DCD Pipelined Reads
The GS8321E18/32/36E is a DCD (Dual Cycle Deselect)
pipelined synchronous SRAM. SCD (Single Cycle Deselect)
versions are also available. DCD SRAMs pipeline disable
commands to the same degree as read commands. DCD RAMs
hold the deselect command for one full cycle and then begin
turning off their outputs just after the second rising edge of
clock.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Core and Interface Voltages
The GS8321E18/32/36E operates on a 2.5 V or 3.3 V power
supply. All input are 3.3 V and 2.5 V compatible. Separate
output power (V
from the internal circuits and are 3.3 V and 2.5 V compatible.
215
255
185
210
3.0
5.0
6.5
6.5
GS8321E18/32/36E-250/225/200/166/150/133
200
235
175
200
3.5
6.0
7.0
7.0
190
220
165
190
3.8
6.6
7.5
7.5
DDQ
165
195
155
175
4.0
7.5
8.5
8.5
) pins are used to decouple output noise
mA
mA
mA
mA
ns
ns
ns
ns
© 2003, GSI Technology
250 MHz–133 MHz
2.5 V or 3.3 V V
2.5 V or 3.3 V I/O
DD

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