UPD75206CW NEC [NEC], UPD75206CW Datasheet - Page 58

• Manufacturer Part Number: UPD75206CW
• Description: 4-BIT SINGLE-CHIP MICROCOMPUTER
• Manufacturer: NEC [NEC]

58
15. RECOMMEDED SOLDERING CONDITIONS
“Semiconductor Device Mount Technology” (IEI-1207).
* For the storage period after dry-pack decompression storage conditions are max. 25 C, 65 % RH.
Note Use of more than one soldering method should be avoided (except in the case of pin part heating).
Note
Solderring Method
Solderring Method
Wave soldering
Infrared reflow
VPS
Pin part heating
This product should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions for the surface mounting type, refer to the document
For soldering methods and conditions other than those recommended below, contact our salesman.
Pin part heating
Wave soldering
(lead part only)
PD75206GF-
PD75206CW-
Ensure that the application of wave soldering is limited to the lead part and no solder touches the main
unit directly.
-3BE : 64-pin plastic QFP (body 14
Solder bath temperature: 260 C or less, Duration: 10 sec. max.,
Number of times: Once
Preheating temperature : 120 C max. (package surface temperature)
Package peak temperature: 230 C, Duration: 30 sec. max. (at 210 C or above),
Number of times: Once
Package peak temperature: 215 C, Duration: 40 sec. max. (at 200 C or above),
Number of times: Once
Pin part temperature: 300 C or below , Duration: 3 sec. max. (per device side)
Solder bath temperature: 260 C or below , Duration: 10 sec. max.
Pin part temperature: 260 C or below , Duration: 10 sec. max.
: 64-pin plastic shrink DIP (750 mil)
Table 15-2 Insertion Type Soldering Conditions
Table 15-1 Surface Mounting Type Conditions
Solderring Conditions
Solderring Conditions
20 mm)
Condition Symbol
Recommended
WS60-00-1
VP15-00-1
IR-30-00-1
PD75206
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