SC16C2550B_07 PHILIPS [NXP Semiconductors], SC16C2550B_07 Datasheet - Page 43

• Manufacturer Part Number: SC16C2550B_07
• Description: 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
• Manufacturer: PHILIPS [NXP Semiconductors]

NXP Semiconductors
17. Contents
1
2
3
3.1
4
5
5.1
5.2
6
6.1
6.2
6.3
6.4
6.5
6.6
6.7
7
7.1
7.2
7.2.1
7.2.2
7.3
7.3.1
7.3.1.1
7.3.1.2
7.3.2
7.4
7.5
7.6
7.7
7.8
7.9
7.10
8
9
10
10.1
11
12
12.1
12.2
12.2.1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 9
Register descriptions . . . . . . . . . . . . . . . . . . . 15
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 25
Static characteristics. . . . . . . . . . . . . . . . . . . . 25
Dynamic characteristics . . . . . . . . . . . . . . . . . 26
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 33
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
UART A-B functions . . . . . . . . . . . . . . . . . . . . . 9
Internal registers. . . . . . . . . . . . . . . . . . . . . . . 10
FIFO operation . . . . . . . . . . . . . . . . . . . . . . . . 11
Hardware/software and time-out interrupts. . . 11
Programmable baud rate generator . . . . . . . . 12
DMA operation . . . . . . . . . . . . . . . . . . . . . . . . 13
Loop-back mode . . . . . . . . . . . . . . . . . . . . . . . 13
Transmit (THR) and Receive (RHR) Holding
Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Interrupt Enable Register (IER) . . . . . . . . . . . 16
IER versus Transmit/Receive FIFO interrupt
mode operation. . . . . . . . . . . . . . . . . . . . . . . . 17
IER versus Receive/Transmit FIFO polled
mode operation. . . . . . . . . . . . . . . . . . . . . . . . 17
FIFO Control Register (FCR) . . . . . . . . . . . . . 17
DMA mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Mode 0 (FCR bit 3 = 0) . . . . . . . . . . . . . . . . . . 17
Mode 1 (FCR bit 3 = 1) . . . . . . . . . . . . . . . . . . 17
FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Interrupt Status Register (ISR) . . . . . . . . . . . . 19
Line Control Register (LCR) . . . . . . . . . . . . . . 20
Modem Control Register (MCR) . . . . . . . . . . . 21
Line Status Register (LSR) . . . . . . . . . . . . . . . 22
Modem Status Register (MSR). . . . . . . . . . . . 23
Scratchpad Register (SPR) . . . . . . . . . . . . . . 24
SC16C2550B external reset condition . . . . . . 24
Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . 27
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Through-hole mount packages . . . . . . . . . . . . 37
Soldering by dipping or by solder wave . . . . . 37
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
12.2.2
12.3
12.3.1
12.3.2
12.3.3
12.4
13
14
15
15.1
15.2
15.3
15.4
16
17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 41
Revision history . . . . . . . . . . . . . . . . . . . . . . . 41
Legal information . . . . . . . . . . . . . . . . . . . . . . 42
Contact information . . . . . . . . . . . . . . . . . . . . 42
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 37
Surface mount packages . . . . . . . . . . . . . . . . 37
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 37
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 38
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 39
Package related soldering information . . . . . . 39
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 42
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 42
SC16C2550B
Document identifier: SC16C2550B_4
Date of release: 15 February 2007
All rights reserved.