SC16C554BIB64 PHILIPS [NXP Semiconductors], SC16C554BIB64 Datasheet - Page 48

• Manufacturer Part Number: SC16C554BIB64
• Description: 5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 16-byte FIFOs
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
9397 750 13133
Product data sheet
12.4 Manual soldering
12.5 Package related soldering information
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C
or 265 C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 C and 320 C.
Table 27:
[1]
[2]
[3]
Package
BGA, HTSSON..T
SSOP..T
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
•
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods .
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 C
body peak temperature must be kept as low as possible.
[5]
transport direction of the printed-circuit board.
, SO, SOJ
[3]
[1]
, TFBGA, VFBGA, XSON
Suitability of surface mount IC packages for wave and reflow soldering methods
[8]
, PMFP
[3]
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 16-byte FIFOs
, LBGA, LFBGA, SQFP,
[9]
Rev. 01 — 9 February 2005
, WQCCN..L
[8]
10 C measured in the atmosphere of the reflow oven. The package
Soldering method
Wave
not suitable
not suitable
suitable
not recommended
not recommended
not suitable
SC16C554B/554DB
[4]
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
[5] [6]
[7]
Reflow
suitable
suitable
suitable
suitable
suitable
not suitable
[2]
48 of 51