UPC8129GR-E1 NEC, UPC8129GR-E1 Datasheet - Page 27

• Manufacturer Part Number: UPC8129GR-E1
• Description: UP CONVERTER WITH AGC FUNCTION + QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS
• Manufacturer: NEC

NOTE ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
conditions than the recommended conditions are to be consulted with sales representatives.
PC8129GR
Infrared ray reflow
VPS
Wave soldering
Partial heating method
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.x. 1000 pF) to the V
This product should be soldered in the following recommended conditions.
Note Exposure limit before soldering after dry-pack package is opened.
Caution Apply only a single process at once, except for “Partial heating method”.
Soldering process
Storage conditions: 25 °C and relative humidity at 65 % or less.
For details of recommended soldering conditions for surface mounting, refer to information
document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Peak package’s surface temperature: 235 °C or below,
Reflow time: 30 seconds or below (210 °C or higher)
Number of reflow process: 2, Exposure limit
Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (200 °C or higher)
Number of reflow process: 2, Exposure limit
Solder temperature: 260 °C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit
Terminal temperature: 300 °C or below,
Flow time: 3 seconds/pin or below,
Exposure limit
Note
Data Sheet P12781EJ2V0DS00
: None
Soldering conditions
CC
pin.
Note
Note
Note
: None
: None
: None
Other soldering method and
PC8129GR
WS60-00-1
VP15-00-2
IR35-00-2
Symbol
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