SAA7826HL Philips Semiconductors, SAA7826HL Datasheet - Page 86

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SAA7826HL

Manufacturer Part Number
SAA7826HL
Description
CD audio decoder/ digital servo and filterless DAC with integrated pre-amp and laser control
Manufacturer
Philips Semiconductors
Datasheet

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Philips Semiconductors
16.5
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note ” (AN01026); order a copy
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
5. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
2003 Oct 01
BGA, LBGA, LFBGA, SQFP, SSOP-T
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CD audio decoder, digital servo and filterless
DAC with integrated pre-amp and laser control
from your Philips Semiconductors sales office.
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 C
must be kept as low as possible.
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(5)
Suitability of surface mount IC packages for wave and reflow soldering methods
, SO, SOJ
10 C measured in the atmosphere of the reflow oven. The package body peak temperature
PACKAGE
(3)
(1)
, TFBGA, VFBGA
86
not suitable
not suitable
suitable
not recommended
not recommended
WAVE
(4)
SOLDERING METHOD
(5)(6)
(7)
suitable
suitable
suitable
suitable
suitable
Product specification
REFLOW
SAA7826
(2)

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