RJ80535 Intel, RJ80535 Datasheet - Page 69

• Manufacturer Part Number: RJ80535
• Description: Pentium M Processor
• Manufacturer: Intel

5
Intel
®
Pentium
®
Thermal Specifications and
Design Considerations
The Intel Pentium M processor requires a thermal solution to maintain temperatures within
operating limits. A complete thermal solution includes both component and system level thermal
management features. Component level thermal solutions include active or passive heatsinks or
heat exchangers attached to the processor exposed die. The solution should make firm contact with
the die while maintaining processor mechanical specifications such as pressure. A typical system
level thermal solution may consist of a processor fan ducted to a heat exchanger that is thermally
coupled to the processor using a heat pipe or direct die attachment. A secondary fan or air from the
processor fan may also be used to cool other platform components or lower the internal ambient
temperature within the system. The processor must remain within the minimum and maximum
junction temperature (Tj) specifications at the corresponding Thermal Design Power (TDP) value
listed in
Intel Thermal Monitor.
Refer to
cause the processor to consume the theoretical maximum power dissipation for sustained time
periods. Intel recommends that complete thermal solution designs target the Thermal Design
Power (TDP) indicated in
the processor in the unlikely event that an application exceeds the TDP recommendation for a
sustained period of time. For more details on the usage of this feature, refer to
cases the Intel Thermal Monitor feature must be enabled for the processor to remain within
specification.
M Processor Datasheet
Table
Section 5.1.2
23. The maximum junction temperature is defined by an activation of the processor
for more details. Analysis indicates that real applications are unlikely to
Table
23. The Intel Thermal Monitor feature is designed to help protect
Thermal Specifications and Design Considerations
Section
5.1.2. In all
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