ADAU1373BCBZ-RL AD [Analog Devices], ADAU1373BCBZ-RL Datasheet - Page 21
ADAU1373BCBZ-RL
Manufacturer Part Number
ADAU1373BCBZ-RL
Description
Low Power Codec with Speaker and Headphone Amplifier
Manufacturer
AD [Analog Devices]
Datasheet
1.ADAU1373BCBZ-RL.pdf
(296 pages)
- Current page: 21 of 296
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ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
Power Supply
Analog Input Voltage (Signal Pins)
Digital Input Voltage (Signal Pins)
Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
SPKVDD, IOVDDx
DVDD, AVDD
HPVDD
AIN4R/AIN4N, AIN3R/AIN3N,
MCLK1, BCLKA, LRCLKA, SDATAINA,
MCLK2, BCLKB, LRCLKB, SDATAINB,
BCLKC, LRCLKC, SDATAINC, GPIO3
DMIC1_2_DATA, DMIC3_4_DATA,
SDA, SCL, GPIO4, MODE, ADDR, SD
Operating Range
Storage Range
Junction Range
Lead Temperature (Soldering, 60 sec)
AIN2R/AIN2N, AIN1R/AIN1N,
AIN4L/AIN4P, AIN3L/AIN3P,
AIN2L/AIN4P, AIN1L/AIN1P
GPIO1
GPIO2
DMIC_CLK
Rating
−0.3 V to +5.5 V
−0.3 V to +1.98 V
−0.3 V to +1.98 V
–0.3 V to AVDD + 0.3 V
–0.3 V to IOVDD1 + 0.3 V
–0.3 V to IOVDD2 + 0.3 V
–0.3 V to IOVDD3 + 0.3 V
–0.3 V to IOVDD4 + 0.3 V
–0.3 V to IOVDD5 + 0.3 V
−40°C to +85°C
−65°C to +150°C
−65°C to +165°C
300°C
Rev. 0 | Page 21 of 296
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance
Package Type
81-Lead, 4.0 mm × 3.8 mm WLCSP
1
ESD CAUTION
JA
the
Applicable for a 4-layer board. For more information on the WLCSP, see
is specified for the worst-case conditions, that is, a device
AN-617
Application Note, MicroCSP Wafer Level Chip Scale Package.
1
ADAU1373
θ
30
JA
Unit
°C/W
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