MC68HC908LK24 MOTOROLA [Motorola, Inc], MC68HC908LK24 Datasheet - Page 454

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MC68HC908LK24

Manufacturer Part Number
MC68HC908LK24
Description
Microcontrollers
Manufacturer
MOTOROLA [Motorola, Inc]
Datasheet

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Mechanical Specifications
25.5 80-Pin Low-Profile Quad Flat Pack (LQFP)
Data Sheet
454
4X
PIN 1
IDEx
A
A
0.200 C
20
A2
A1
1
Figure 25-3. 80-Pin Low-Profile Quad Flat Pack (Case No. 917)
21
80
A–B
D/2
D
8X
76X
θ
2
e
D
Freescale Semiconductor, Inc.
For More Information On This Product,
VIEW P
D1
D
S
0.25
D1/2
VIEW P
Go to: www.freescale.com
Mechanical Specifications
61
40
(L1)
60
41
(L2)
4X
R
θ
B
(R1)
1
R
E1/2
H
GAGE
PLANE
(R2)
L
0.200 H
VIEW Y
E1
C
E/2
0.1
θ
SEATING
PLANE
A–B
C
E
D
MC68HC908LJ24/LK24 — Rev. 2
NOTES:
c
1. ALL DIMENSIONS AND TOLERANCES TO
2.
3.
4. DATUMS A, B AND D TO BE DETERMINED AT
5. DIMENSIONS D AND E TO BE DETERMINED AT
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE
7. DIMENSION b DOES NOT INCLUDE DAMBAR
ROTATED
CONFORM TO ASME Y14.5M, 1994.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLANE H IS COINCIDENT WITH THE
BOTTOM OF THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE BOTTOM OF
THE PARTING LINE.
DATUM PLANE H.
SEATING PLANE C.
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
D1 AND E1 DO INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE H.
PROTRUSION. THE DAMBAR PROTRUSION
SHALL NOT CAUSE THE b DIMENSION TO
EXCEED 0.35.
3 PLACES
DIM
VIEW Y
A1
A2
D1
E1
L1
L2
R1
R2
b1
c1
θ1
θ2
A
D
E
L
S
b
θ
c
e
SECTION B–B
0.08
80 PLACES
MILLIMETERS
0.45
10°
MIN
0.05
1.35
0.17
0.17
0.12
0.12
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
90°
M
1.00 REF
0.50 REF
0.20 REF
0.20 REF
0.17 REF
0.50 BSC
e/2
b1
b
B
B
C
CLOCKWISE
MAX
0.27
0.23
0.20
0.16
14°
1.60
0.15
1.45
0.75
A–B
X
D
X=A, B, or D
c1
MOTOROLA
BASE
METAL
PLATING

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