FSA3031 FAIRCHILD [Fairchild Semiconductor], FSA3031 Datasheet - Page 2

• Manufacturer Part Number: FSA3031
• Manufacturer: FAIRCHILD [Fairchild Semiconductor]

© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
PIN#1 IDENT
SCALE : 2X
PIN#1 IDENT
OPTION 1
DETAIL A
LEAD
2X
0.10 C
0.08 C
0.05
0.00
0.10 C
PACKAGE
BOTTOM VIEW
1
EDGE
0.35
0.45
0.55 MAX.
TOP VIEW
SIDE VIEW
12
3
(11X)
Figure 20. 12-Lead, Ultrathin Molded Leadless Package (UMLP)
PLANE
SCALE : 2X
SEATING
OPTION 2
1.80
LEAD
6
9
0.152
C
2X
0.25
0.15 (12X)
A
0.40
1.80
0.10 C A B
0.05 C
0.10 C
B
12
NOTES:
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
D. LAND PATTERN RECOMMENDATION IS
E. DRAWING FILENAME: MKT-UMLP12Arev4.
A. PACKAGE DOES NOT FULLY CONFORM TO
JEDEC STANDARD.
ASME Y14.5M, 1994.
BASED ON FSC DESIGN ONLY.
(12X)
0.588
0.40
0.20
0.10
0.45
0.35
1
RECOMMENDED
LAND PATTERN
SCALE : 2X
DETAIL A
2.10
0.10
0.10
2.10
(11X)
0.563
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