ADD8708WCPZ-REEL7 AD [Analog Devices], ADD8708WCPZ-REEL7 Datasheet - Page 13
ADD8708WCPZ-REEL7
Manufacturer Part Number
ADD8708WCPZ-REEL7
Description
18-Channel Gamma Buffer with Regulator
Manufacturer
AD [Analog Devices]
Datasheet
1.ADD8708WCPZ-REEL7.pdf
(16 pages)
Notes:
1.
2.
3.
4.
Areas in black represent the board metallization.
Areas in white represent the solder mask and vias.
Hatched area is for the heat sink solder paste.
The thermal pad is electrically active. The solder mask opening should be 0.150 mm larger than the pad size, resulting in 0.075 mm
of clearance between the copper pad and solder mask.
SOLDER PASTE AREA
5.93mm
HEAT SINK
Figure 24. 48-Pin LFCSP (CP-48) Land Pattern—Dimensions Shown in Millimeters
1.90mm
1.60mm
Rev. 0 | Page 13 of 16
0.33mm DIAMETER
THERMAL VIA
7.31mm
5.40mm
0.5mm
0.075mm
0.075mm
0.28mm
1.60mm
0.69mm
5.78mm
ADD8708