HD151TS304ARPEL RENESAS [Renesas Technology Corp], HD151TS304ARPEL Datasheet

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HD151TS304ARPEL

Manufacturer Part Number
HD151TS304ARPEL
Description
Spread Spectrum Clock for EMI Solution
Manufacturer
RENESAS [Renesas Technology Corp]
Datasheet

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Part Number:
HD151TS304ARPEL
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
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Part Number:
HD151TS304ARPEL
Quantity:
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HD151TS304ARP
Spread Spectrum Clock for EMI Solution
Description
The HD151TS304A is a high-performance Spread Spectrum Clock modulator. It is suitable for low EMI
solution.
Features
Key Specifications
Part Name
HD151TS304ARPEL
Note: Please consult the sales office for the above package availability.
Rev.4.00, May.19.2003, page 1 of 12
Supports 10 MHz to 60 MHz operation. (Designed for XIN = 24 MHz and 48 MHz)
1 copy of clock out with spread spectrum modulation @3.3 V
1 copy of reference clock @3.3 V
Programmable spread spectrum modulation ( 0.25%, 0.5%, 1.5% central spread modulation and
spread spectrum disable mode.)
SOP–8pin
Pin to pin compatible with HD151TS304RP
Supply voltages : VDD = 3.3 V±0.165 V
Ta = 0 to 70°C operating range
Clock output duty cycle = 50±5%
Cycle to cycle jitter = 250 ps typ.
Output slew rate = 0.8V/ns min.
Ordering Information
Package Type
SOP-8 pin (JEDEC)
Package Code Package
FP-8DC
Abbreviation
RP
(Previous ADE-205-691C(Z))
Taping
Abbreviation (Quantity)
EL (2,500 pcs / Reel)
REJ03D0020-0400Z
May.19.2003
Rev.4.00

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HD151TS304ARPEL Summary of contents

Page 1

... Clock output duty cycle = 50±5% Cycle to cycle jitter = 250 ps typ. Output slew rate = 0.8V/ns min. Ordering Information Part Name Package Type HD151TS304ARPEL SOP-8 pin (JEDEC) Note: Please consult the sales office for the above package availability. Rev.4.00, May.19.2003, page (Previous ADE-205-691C(Z)) Package Code Package ...

Page 2

HD151TS304ARP Block Diagram XIN OSC 1/m R=1 M XOUT R=100 k SEL0 SEL1 R=100 k Pin Arrangement SSCCLKOUT VDD GND XIN Rev.4.00, May.19.2003, page VDD GND Synthesizer 1/n SSC Modulator Mode Control ...

Page 3

HD151TS304ARP SSC Function Table SEL1 : Note: 1.5% SSC is selected for default by internal pull-up & down resistors. Clock Frequency Table XIN(MHz) SSCCLKOUT(MHz Notes: 1. With spread ...

Page 4

HD151TS304ARP Absolute Maximum Ratings Item Supply voltage Input voltage *1 Output voltage Input clamp current Output clamp current Continuous output current Maximum power dissipation 55°C (in still air) Storage temperature Notes: Stresses beyond those listed under “absolute ...

Page 5

HD151TS304ARP DC Electrical Characteristics 70°C, VDD = 3.3 V±5% Item Symbol Min Input low voltage V — IL Input high voltage V 2.0 IH Input current I — I — Input slew rate 1 Input capacitance ...

Page 6

HD151TS304ARP AC Electrical Characteristics / Clock Output & SSC Clock Output Ta = 25°C, VDD = 3 Item Symbol Min *1, 2 Cycle to cycle jitter t — CCS — — — — — ...

Page 7

HD151TS304ARP SSCCLKOUT (or CLKOUT) Rev.4.00, May.19.2003, page tcycle n tcycle n (tcycle n) - (tcycle n+1) CCS Figure 1 Cycle to cycle jitter ...

Page 8

HD151TS304ARP Application Information 1. Recommended Circuit Configuration The power supply circuit of the optimal performance on the application of a system should refer to Fig. 2. VDD decoupling is important to both reduce Jitter and EMI radiation. The C1 decoupling ...

Page 9

HD151TS304ARP 2. Example Board Layout Configuration G R1 SSCCLKOUT 0 Crystal connection or Reference input Figure 3 Example Board Layout Rev.4.00, May.19.2003, page VDD (+3.3 V Supply ...

Page 10

HD151TS304ARP 3. Example of TS300 EMI Solution IC’s Application Spread Spectrum Spread Spectrum Modulated Clock Modulated Clock XIN XIN TS30X TS30X XOUT XOUT SSC SSC CLKOUT CLKOUT 3.3 V CMOS level ref. Clock 3.3 V CMOS level ref. Clock Spread ...

Page 11

HD151TS304ARP Package Dimensions 4.90 5.3 Max 8 1 0.75 Max 1.27 *0.42 ± 0.08 0.40 ± 0.06 *Dimension including the plating thickness Base material dimension Rev.4.00, May.19.2003, page 0.10 6.10 – 0.30 + 0.67 ...

Page 12

HD151TS304ARP Sales Strategic Planning Div. Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. ...

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