ADP1614 AD [Analog Devices], ADP1614 Datasheet - Page 4

• Manufacturer Part Number: ADP1614
• Description: 650 kHz/1.3 MHz, 4 A, Step-Up
• Manufacturer: AD [Analog Devices]

ADP1614
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VIN, EN, FB to GND
CLRES to GND
COMP to GND
SS to GND
SW to GND
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination.
Rating
−0.3 V to +6 V
−0.3 V to VIN
1.0 V to 1.6 V
−0.3 V to +1.3 V
21 V
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
Rev. 0 | Page 4 of 16
THERMAL RESISTANCE
The junction-to-ambient thermal resistance (θ
is specified for the worst-case conditions, that is, a device soldered
in a circuit board for surface-mount packages. The θ
dependent on the application and board layout. In applications
where high maximum power dissipation exists, attention to
thermal board design is required. The value of θ
depending on the printed circuit board (PCB) material, layout,
and environmental conditions.
The boundary conditions for the thermal resistance of the
ADP1614
25°C ambient temperature, JESD 51-9, and 1 W power input on a
4-layer board.
Table 3. Thermal Resistance
Package Type
10-Lead LFCSP
1
ESD CAUTION
Thermal numbers per JEDEC standard JESD 51-9.
are modeled under natural convection cooling at
1
θ
47
JA
θ
7.22
JC
Data Sheet
JA
) of the package
JA
may vary,
JA
Unit
°C/W
is highly