SE98 NXP [NXP Semiconductors], SE98 Datasheet - Page 4

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SE98

Manufacturer Part Number
SE98
Description
DDR memory module temp sensor, 3.3 V
Manufacturer
NXP [NXP Semiconductors]
Datasheet

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NXP Semiconductors
6. Pinning information
SE98_4
Product data sheet
6.1 Pinning
6.2 Pin description
Table 2.
[1]
Symbol
A0
A1
A2
V
SDA
SCL
EVENT
V
Fig 2.
SS
DD
[1]
In general, application of 10 V on the A0 pin would not damage the pin, but NXP Semiconductors does not
guarantee the overvoltage for this pin.
V
A0
A1
A2
SS
Pin configuration for TSSOP8
1
2
3
4
Pin description
Pin
1
2
3
4
5
6
7
8
SE98PW
Type
I
I
I
ground
I/O
I
O
power
Rev. 04 — 2 February 2009
002aab806
8
7
6
5
V
EVENT
SCL
SDA
Description
I
I
I
device ground
SMBus/I
Must have external pull-up resistor.
SMBus/I
Must have external pull-up resistor.
Thermal alarm output for high/low and critical temperature
limit (open-drain). Must have external pull-up resistor.
device power supply (3.0 V to 3.6 V)
DD
2
2
2
C-bus/SMBus slave address bit 0
C-bus/SMBus slave address bit 1
C-bus/SMBus slave address bit 2
2
2
C-bus serial data input/output (open-drain).
C-bus serial clock input/output (open-drain).
DDR memory module temp sensor, 3.3 V
Fig 3.
terminal 1
index area
V
A0
A1
A2
Pin configuration for HVSON8
SS
1
2
3
4
Transparent top view
SE98TK
© NXP B.V. 2009. All rights reserved.
002aab804
8
7
6
5
SE98
V
EVENT
SCL
SDA
DD
4 of 39

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