TE28F640C3TC80 Intel Corporation, TE28F640C3TC80 Datasheet



Manufacturer Part Number
Intel Corporation

Specifications of TE28F640C3TC80

Memory (C3)
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Product Features
The Intel
0.13 m and 0.18 m technologies, represents a feature-rich solution for low-power applications.
The C3 device incorporates low-voltage capability (3 V read, program, and erase) with high-
speed, low-power operation. Flexible block locking allows any block to be independently locked
or unlocked. Add to this the Intel
effective, flexible, monolithic code plus data storage solution. Intel
Memory (C3) products will be available in 48-lead TSOP, 48-ball CSP, and 64-ball Easy BGA
packages. Additional information on this product family can be obtained by accessing the Intel
Flash website: http://www.intel.com/design/flash.
Notice: This specification is subject to change without notice. Verify with your local Intel sales
office that you have the latest datasheet before finalizing a design.
Flexible SmartVoltage Technology
1.65 V–2.5 V or 2.7 V–3.6 V I/O Option
High Performance
Optimized Architecture for Code Plus
Data Storage
Flexible Block Locking
Low Power Consumption
Extended Temperature Operation
— 2.7 V– 3.6 V Read/Program/Erase
— 12 V for Fast Production Programming
— Reduces Overall System Power
— 2.7 V– 3.6 V: 70 ns Max Access Time
— Eight 4 Kword Blocks, Top or Bottom
— Up to One Hundred-Twenty-Seven 32
— Fast Program Suspend Capability
— Fast Erase Suspend Capability
— Lock/Unlock Any Block
— Full Protection on Power-Up
— WP# Pin for Hardware Block Protection
— 9 mA Typical Read
— 7 A Typical Standby with Automatic
— –40 °C to +85 °C
Parameter Boot
Kword Blocks
Power Savings Feature (APS)
Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
Advanced+ Boot Block Flash
Flash Data Integrator (FDI) software and you have a cost-
128-bit Protection Register
Extended Cycling Capability
Standard Surface Mount Packaging
ETOX™ VIII (0.13 m Flash
ETOX™ VII (0.18 m Flash Technology
ETOX™ VI (0.25 m Flash Technology
— 64 bit Unique Device Identifier
— 64 bit User Programmable OTP Cells
— Minimum 100,000 Block Erase Cycles
— Intel
— Supports Top or Bottom Boot Storage,
— Intel Basic Command Set
— Common Flash Interface (CFI)
— 48-Ball BGA*/VFBGA
— 64-Ball Easy BGA Packages
— 48-Lead TSOP Package
— 16, 32 Mbit
— 16, 32, 64 Mbit
— 8, 16 and 32 Mbit
Streaming Data (e.g., voice)
Flash Data Integrator (FDI)
Advanced+ Boot Block Flash
Order Number: 290645-017
October 2003

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