MT41J128M16HA-125IT:D Micron Semiconductor Products, MT41J128M16HA-125IT:D Datasheet

MT41J128M16HA-125IT:D

Manufacturer Part Number

MT41J128M16HA-125IT:D

Description

Manufacturer

Micron Semiconductor Products

Datasheet

1.MT41J128M16JT-125K.pdf (206 pages)

Specifications of MT41J128M16HA-125IT:D

Pack_quantity

1000

Comm_code

85423239

Lead_time

Eccn

EAR99

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DDR3 SDRAM

MT41J512M4 – 64 Meg x 4 x 8 Banks

MT41J256M8 – 32 Meg x 8 x 8 Banks

MT41J128M16 – 16 Meg x 16 x 8 Banks

Features

Table 1: Key Timing Parameters

PDF: 09005aef826aaadc

2Gb_DDR3_SDRAM.pdf – Rev. P 2/12 EN

• V

• 1.5V center-terminated push/pull I/O

• Differential bidirectional data strobe

• 8n-bit prefetch architecture

• Differential clock inputs (CK, CK#)

• 8 internal banks

• Nominal and dynamic on-die termination (ODT)

• Programmable CAS READ latency (CL)

• Posted CAS additive latency (AL)

• Programmable CAS WRITE latency (CWL) based on

• Fixed burst length (BL) of 8 and burst chop (BC) of 4

• Selectable BC4 or BL8 on-the-fly (OTF)

• Self refresh mode

• T

• Self refresh temperature (SRT)

• Write leveling

• Multipurpose register

• Output driver calibration

Notes:

for data, strobe, and mask signals

(via the mode register set [MRS])

– 64ms, 8192 cycle refresh at 0°C to 85°C

– 32ms, 8192 cycle refresh at 85°C to 95°C

Speed Grade

of 0°C to 95°C

-093

-107

= V

-125

-15E

-187E

1, 2, 3, 4

DDQ

1. Backward compatible to 1066, CL = 7 (-187E).

2. Backward compatible to 1333, CL = 9 (-15E).

3. Backward compatible to 1600, CL = 11 (-125).

4. Backward compatible to 1866, CL = 13 (-107).

1, 2, 3

1, 2,

= 1.5V ±0.075V

Products and specifications discussed herein are subject to change by Micron without notice.

Data Rate (MT/s)

2133

1866

1600

1333

1066

Target

14-14-14

13-13-13

11-11-11

9-9-9

7-7-7

RCD-

RP-CL

Options

• Configuration

• FBGA package (Pb-free) – x4, x8

• FBGA package (Pb-free) – x16

• Timing – cycle time

• Operating temperature

• Revision

– 512 Meg x 4

– 256 Meg x 8

– 128 Meg x 16

– 78-ball (8mm x 10.5mm) Rev. H,M,J,K

– 78-ball (9mm x 11.5mm) Rev. D

– 96-ball (9mm x 14mm) Rev. D

– 96-ball (8mm x 14mm) Rev. K

– 938ps @ CL = 14 (DDR3-2133)

– 1.071ns @ CL = 13 (DDR3-1866)

– 1.25ns @ CL = 11 (DDR3-1600)

– 1.5ns @ CL = 9 (DDR3-1333)

– 1.87ns @ CL = 7 (DDR3-1066)

– Commercial (0°C ≤ T

– Industrial (–40°C ≤ T

Note:

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1. Not all options listed can be combined to

RCD (ns)

define an offered product. Use the part

catalog search on

for available offerings.

2Gb: x4, x8, x16 DDR3 SDRAM

13.09

13.91

13.75

13.5

13.1

≤ +95°C)

RP (ns)

13.09

13.91

13.75

13.5

13.1

http://www.micron.com

Features

CL (ns)

13.09

13.91

13.75

13.5

13.1

:D/:H/:J/:K/

Marking

128M16

512M4

256M8

-187E

None

-093

-107

-125

-15E

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