C1206C473K5RAC Kemet, C1206C473K5RAC Datasheet
C1206C473K5RAC
Manufacturer Part Number
C1206C473K5RAC
Description
Manufacturer
Kemet
Specifications of C1206C473K5RAC
Remarks
pb-free
Date_code
2009+
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C1206C473K5RAC7210
Manufacturer:
KEMET
Quantity:
600 000
72
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)
+ For extended value 1210 case size - solder reflow only.
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF
C – ±0.25pF
D – ±0.5pF
F – ±1%
G – ±2%
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
• Available Capacitance Tolerances: ±0.10 pF; ±0.25
SIZE CODE
EIA SIZE
CODE
0201*
0402*
0805*
1206*
1210*
1825*
barrier
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
0603
1812
2220
2225
0402*
0603*
0805*
1206*
1210*
1825*
1812
2220
2225
EIA
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
SIZE CODE
SIZE CODE
METRIC
(Ref only)
METRIC
0603
1005
1608
2012
3216
3225
4532
4564
5650
5664
1005
1608
2012
3216
3225
4532
4564
5650
5664
J – ±5%
K – ±10%
M – ±20%
P – (GMV) – special order only
Z – +80%, -20%
T
0.6 (.024) ± .03 (.001)
1.6 (.063) ± .15 (.006)
2.0 (.079) ± .20 (.008)
3.2 (.126) ± .20 (.008)
3.2 (.126) ± .20 (.008)
4.5 (.177) ± .30 (.012)
4.5 (.177) ± .30 (.012)
5.6 (.220) ± .40 (.016)
5.6 (.220) ± .40 (.016)
1.0 (.04) ± .05 (.002)
CAPACITOR ORDERING INFORMATION
DIMENSIONS—MILLIMETERS AND (INCHES)
L - LENGTH
CERAMIC CHIP CAPACITORS
W
S
* Part Number Example: C0805C103K5RAC
C 0805 C 103 K 5 R A C*
CAPACITOR OUTLINE DRAWINGS
0.3 ± (.012) ± .03 (.001)
1.25 (.049) ± .20 (.008)
0.8 (.032) ± .15 (.006)
1.6 (.063) ± .20 (.008)
2.5 (.098) ± .20 (.008)
3.2 (.126) ± .30 (.012)
6.4 (.252) ± .40 (.016)
5.0 (.197) ± .40 (.016)
6.3 (.248) ± .40 (.016)
0.5 (.02) ± .05 (.002)
L
W - WIDTH
FEATURES
B
for thickness
THICKNESS
See page 78
dimensions.
ELECTRODES
T
• Tape and reel packaging per EIA481-1. (See page
• RoHS Compliant
92 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
(14 digits - no spaces)
0.15 (.006) ± .05 (.002)
0.35 (.014) ± .15 (.006)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.20 (.008) -.40 (.016)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
B - BANDWIDTH
METALLIZATION
TEMPERATURE CHARACTERISTIC
CONDUCTIVE
C-Standard (Tin-plated nickel barrier)
TIN PLATE
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%) (-55°C + 125°C)
P– X5R (±15%) (-55°C + 85°C)
U – Z5U (+22%, -56%) (+10°C + 85°C)
V – Y5V (+22%, -82%) (-30°C + 85°C)
Change Over Temperature Range
(Standard Chips - For
Military see page 87)
SEPARATION
NICKEL PLATE
0.75 (.030)
minimum
0.3 (.012)
0.7 (.028)
Designated by Capacitance
FAILURE RATE LEVEL
VOLTAGE
1 - 100V
2 - 200V
5 - 50V
7 - 4V
N/A
N/A
N/A
N/A
N/A
N/A
N/A
END METALLIZATION
S
A- Not Applicable
Solder Wave +
Solder Reflow
Solder Reflow
Solder Reflow
TECHNIQUE
MOUNTING
3 - 25V
4 - 16V
8 - 10V
9 - 6.3V
or
Solder
Reflow
or
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