54F574DM NSC [National Semiconductor], 54F574DM Datasheet

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54F574DM

Manufacturer Part Number
54F574DM
Description
Octal D-Type Flip-Flop with TRI-STATE Outputs
Manufacturer
NSC [National Semiconductor]
Datasheet

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C 1995 National Semiconductor Corporation
54F 74F574
Octal D-Type Flip-Flop with TRI-STATE Outputs
General Description
The ’F574 is a high-speed low power octal flip-flop with a
buffered common Clock (CP) and a buffered common Out-
put Enable (OE) The information presented to the D inputs
is stored in the flip-flops on the LOW-to-HIGH Clock (CP)
transition
This device is functionally identical to the ’F374 except for
the pinouts
Logic Symbols
Unit Loading Fan Out
TRI-STATE is a registered trademark of National Semiconductor Corporation
Pin Names
D
CP
OE
O
Note 1 Devices also available in 13 reel Use suffix
Note 2 Military grade device with environmental and burn-in processing Use suffix
0
0
–D
–O
74F574PC
74F574SC (Note 1)
74F574SJ (Note 1)
7
7
Commercial
Data Inputs
Clock Pulse Input (Active LOW)
TRI-STATE Output Enable Input (Active LOW)
TRI-STATE Outputs
54F574DM (Note 2)
54F574FM (Note 2)
54F574LM (Note 2)
TL F 9567
Description
Military
e
SCX and SJX
TL F 9567 – 1
Package
N20A
J20A
M20B
M20D
W20A
E20A
Number
150 40 (33 3)
Features
Y
Y
Y
Y
HIGH LOW
20-Lead (0 300 Wide) Molded Dual-In-Line
20-Lead Ceramic Dual-In-Line
20-Lead (0 300 Wide) Molded Small Outline JEDEC
20-Lead (0 300 Wide) Molded Small Outline EIAJ
20-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier Type C
Inputs and outputs on opposite sides of package
allowing easy interface with microprocessors
Useful as input or output port for microprocessors
Functionally identical to ’F374
TRI-STATE outputs for bus-oriented applications
1 0 1 0
1 0 1 0
1 0 1 0
U L
e
DMQB FMQB and LMQB
54F 74F
b
Package Description
3 mA 24 mA (20 mA)
20 A
20 A
20 A
Output I
Input I
IEEE IEC
b
b
b
IH
OH
0 6 mA
0 6 mA
0 6 mA
I
IL
I
OL
RRD-B30M75 Printed in U S A
TL F 9567 – 4
May 1995

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54F574DM Summary of contents

Page 1

... This device is functionally identical to the ’F374 except for the pinouts Commercial Military 74F574PC 54F574DM (Note 2) 74F574SC (Note 1) 74F574SJ (Note 1) 54F574FM (Note 2) 54F574LM (Note 2) Note 1 Devices also available in 13 reel Use suffix Note 2 Military grade device with environmental and burn-in processing Use suffix ...

Page 2

Connection Diagrams Pin Assignment for DIP SOIC and Flatpak Functional Description The ’F574 consists of eight edge-triggered flip-flops with in- dividual D-type inputs and TRI-STATE true outputs The buffered clock and buffered Output Enable are common to all flip-flops The ...

Page 3

Absolute Maximum Ratings If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature b Ambient Temperature under Bias b Junction Temperature under Bias b Plastic b V Pin Potential ...

Page 4

AC Electrical Characteristics Symbol Parameter f Maximum Clock Frequency max t Propagation Delay PLH PHL n t Output Enable Time PZH t PZL t Output Disable Time PHZ t PLZ AC Operating Requirements Symbol Parameter t ...

Page 5

Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows Temperature Range Family 74F Commercial e 54F Military e Device Type Package Code P ...

Page 6

Physical Dimensions inches (millimeters) (Continued) 20-Lead Ceramic Dual-In-Line Package (D) 20-Lead (0 300 Wide) Molded Small Outline Package JEDEC (S) NS Package Number J20A NS Package Number M20B 6 ...

Page 7

Physical Dimensions inches (millimeters) (Continued) 20-Lead (0 300 Wide) Molded Small Outline Package EIAJ 20-Lead (0 300 Wide) Molded Dual-In-Line Package (P) NS Package Number M20D NS Package Number N20A 7 ...

Page 8

Physical Dimensions inches (millimeters) (Continued) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 ...

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