HS574AK Sipex Corporation, HS574AK Datasheet - Page 14

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HS574AK

Manufacturer Part Number
HS574AK
Description
DIP28
Manufacturer
Sipex Corporation
Datasheets

Specifications of HS574AK

Date_code
04+

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HS574AK
Manufacturer:
MP
Quantity:
354
Part Number:
HS574AK/HS574AA/HS574AAK
Manufacturer:
AMD
Quantity:
1
ORDERING INFORMATION
Model .................... No Missing Codes to; ... Linearity ...................... Gain TC ......................... Temperature Range ............ Package Type
25 s Conversion Time
HS574AA .............. 11 Bits .............................. 1.0 LSB ...................... 50ppm/ C .............. –40 C to +85 C ............ 28–pin, 0.6" Ceramic DIP
HS574AB .............. 12 Bits .............................. 0.5 LSB ...................... 27ppm/ C .............. –40 C to +85 C ............ 28–pin, 0.6" Ceramic DIP
HS574AC .............. 12 Bits .............................. 0.5 LSB ...................... 10ppm/ C .............. –40 C to +85 C ............ 28–pin, 0.6" Ceramic DIP
HS574AJ ............... 11 Bits .............................. 1.0 LSB ...................... 50ppm/ C .............. 0 C to +70 C ................ 28–pin, 0.6" Ceramic DIP
HS574AK .............. 12 Bits .............................. 0.5 LSB ...................... 27ppm/ C .............. 0 C to +70 C ................ 28–pin, 0.6" Ceramic DIP
HS574AL .............. 12 Bits .............................. 0.5 LSB ...................... 10ppm/ C .............. 0 C to +70 C ................ 28–pin, 0.6" Ceramic DIP
HS574AS .............. 11 Bits .............................. 1.0 LSB ...................... 50ppm/ C .............. –55 C to +125 C .......... 28–pin, 0.6" Ceramic DIP
HS574AT .............. 12 Bits .............................. 0.5 LSB ...................... 25ppm/ C .............. –55 C to +125 C .......... 28–pin, 0.6" Ceramic DIP
HS574AU .............. 12 Bits .............................. 0.5 LSB ...................... 12.5ppm/ C ........... –55 C to +125 C .......... 28–pin, 0.6" Ceramic DIP
HS574AS/883* ...... 11 Bits .............................. 1.0 LSB ...................... 50ppm/ C .............. –55 C to +125 C .......... 28–pin, 0.6" Ceramic DIP
HS574AT/883* ...... 12 Bits .............................. 0.5 LSB ...................... 25ppm/ C .............. –55 C to +125 C .......... 28–pin, 0.6" Ceramic DIP
HS574AU/883* ..... 12 Bits .............................. 0.5 LSB ...................... 12.5ppm/ C ........... –55 C to +125 C .......... 28–pin, 0.6" Ceramic DIP
15 s Conversion Time
SP674AA .............. 11 Bits .............................. 1.0 LSB ...................... 50ppm/ C .............. –40 C to +85 C ............ 28–pin, 0.6" Ceramic DIP
SP674AB .............. 12 Bits .............................. 0.5 LSB ...................... 27ppm/ C .............. –40 C to +85 C ............ 28–pin, 0.6" Ceramic DIP
SP674AC .............. 12 Bits .............................. 0.5 LSB ...................... 10ppm/ C .............. –40 C to +85 C ............ 28–pin, 0.6" Ceramic DIP
SP674AJ ............... 11 Bits .............................. 1.0 LSB ...................... 50ppm/ C .............. 0 C to +70 C ................ 28–pin, 0.6" Ceramic DIP
SP674AK .............. 12 Bits .............................. 0.5 LSB ...................... 27ppm/ C .............. 0 C to +70 C ................ 28–pin, 0.6" Ceramic DIP
SP674AL ............... 12 Bits .............................. 0.5 LSB ...................... 10ppm/ C .............. 0 C to +70 C ................ 28–pin, 0.6" Ceramic DIP
SP674AS .............. 11 Bits .............................. 1.0 LSB ...................... 50ppm/ C .............. –55 C to +125 C .......... 28–pin, 0.6" Ceramic DIP
SP674AT ............... 12 Bits .............................. 0.5 LSB ...................... 25ppm/ C .............. –55 C to +125 C .......... 28–pin, 0.6" Ceramic DIP
SP674AU .............. 12 Bits .............................. 0.5 LSB ...................... 12.5ppm/ C ........... –55 C to +125 C .......... 28–pin, 0.6" Ceramic DIP
SP674AS/883* ...... 11 Bits .............................. 1.0 LSB ...................... 50ppm/ C .............. –55 C to +125 C .......... 28–pin, 0.6" Ceramic DIP
SP674AT/883* ...... 12 Bits .............................. 0.5 LSB ...................... 25ppm/ C .............. –55 C to +125 C .......... 28–pin, 0.6" Ceramic DIP
SP674AU/883* ...... 12 Bits .............................. 0.5 LSB ...................... 12.5ppm/ C ........... –55 C to +125 C .......... 28–pin, 0.6" Ceramic DIP
* MIL–STD–883C processing.
NOTE: Electrical specifications for –AA, –AB and –AC grades are the same as –AJ, –AK, and –AL models respectively, with the exception of
extended operating temperature range performance from –40 C to +85 C.
Please consult the factory for other packaging options.
16

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