APM4550KC-TRL ANPEC [Anpec Electronics Coropration], APM4550KC-TRL Datasheet

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APM4550KC-TRL

Manufacturer Part Number
APM4550KC-TRL
Description
Dual Enhancement Mode MOSFET (N- and P-Channel)
Manufacturer
ANPEC [Anpec Electronics Coropration]
Datasheet
APM4550K
Features
Applications
Ordering and Marking Information
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright
Rev. A.1 - May, 2007
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termina-
tion finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldering operations.
ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classifica-
tion at lead-free peak reflow temperature.
APM4550
APM4550K :
N-Channel
30V/7A,
P-Channel
-30V/-5A,
Super High Dense Cell Design
Reliable and Rugged
Lead Free Available (RoHS Compliant)
Power Management in Notebook Computer,
Portable Equipment and Battery Powered
Systems
R
R
R
R
DS(ON)
DS(ON)
DS(ON)
DS(ON)
ANPEC Electronics Corp.
= 20m (typ.) @ V
= 30m (typ.) @ V
= 40m (typ.) @ V
= 62m (typ.) @ V
APM4550
XXXXX
Dual Enhancement Mode MOSFET (N- and P-Channel)
Lead Free Code
Handling Code
Temp. Range
Package Code
GS
GS
GS
GS
= 10V
= 4.5V
= -10V
= -4.5V
1
Package Code
Operating Junction Temp. Range
Handling Code
Lead Free Code
Pin Description
TR : Tape & Reel
XXXXX - Date Code
K : SOP-8
C : -55 to 150 C
L : Lead Free Device
(2)
G1
N-Channel
(7)
D1 D1
Top View of SOP 8
S1
(1)
(8)
TU : Tube
(4)
G2
www.anpec.com.tw
P-Channel
D2
(5)
(3)
S2
D2
(6)

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APM4550KC-TRL Summary of contents

Page 1

APM4550K Features N-Channel 30V/7A 20m (typ DS(ON 30m (typ DS(ON) P-Channel -30V/-5A 40m (typ DS(ON 62m (typ DS(ON) Super High Dense Cell Design Reliable ...

Page 2

APM4550K Absolute Maximum Ratings Symbol V Drain-Source Voltage DSS V Gate-Source Voltage GSS I * Continuous Drain Current 300 s Pulsed Drain Current DM I Diode Continuous Forward Current * S T Maximum Junction Temperature J T ...

Page 3

APM4550K Electrical Characteristics (Cont.) Symbol Parameter Diode Characteristics a V Diode Forward Voltage SD t Reverse Recovery Time rr Reverse Recovery Q rr Charge b Dynamic Characteristics R Gate Resistance G C Input Capacitance iss C Output Capacitance oss Reverse ...

Page 4

APM4550K Typical Characteristics N-Channel Power Dissipation 2.5 2.0 1.5 1 100 120 140 160 T - Junction Temperature (°C) j Safe Operation Area 100 10 1 0.1 O ...

Page 5

APM4550K Typical Characteristics (Cont.) N-Channel Output Characteristics 4.5,5,6,7,8,9,10V 0.0 0.5 1.0 1 Drain-Source Voltage (V) DS Drain-Source On Resistance ...

Page 6

APM4550K Typical Characteristics (Cont.) N-Channel Drain-Source On Resistance 2. 10V 1.75 DS 1.50 1.25 1.00 0.75 0.50 0.25 R 0.00 -50 - Junction Temperature (°C) j Capacitance 1000 900 ...

Page 7

APM4550K Typical Characteristics (Cont.) P-Channel Power Dissipation 2.5 2.0 1.5 1 100 120 140 160 T - Junction Temperature (°C) j Safe Operation Area 0.1 ...

Page 8

APM4550K Typical Characteristics (Cont.) P-Channel Output Characteristics 20 V =-4.5-5,-6,-7 -8,-9,-10V 0.0 0.5 1.0 1 Drain - Source Voltage (V) DS Drain-Source On Resistance 100 90 80 ...

Page 9

APM4550K Typical Characteristics (Cont.) P-Channel Drain-Source On Resistance 2 -10V GS 1 -5A DS 1.6 1.4 1.2 1.0 0.8 0.6 0.4 R 0.2 -50 - Junction Temperature (°C) j Capacitance 800 ...

Page 10

APM4550K Package Information SOP MIN 0.10 A2 1.25 b 0. 0.25 L 0.40 0 Copyright ANPEC Electronics Corp. Rev. A.1 - May, ...

Page 11

APM4550K Carrier Tape & Reel Dimensions W Application A B 330 1 62 SOP 0.1 1.55 0.1 1.55+ 0.25 4.0 5.5 Devices Per Reel Package Type SOP- 8 Copyright ANPEC Electronics Corp. Rev. A.1 - May, 2007 P ...

Page 12

APM4550K Physical Specifications Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition Tsmax Tsmin 25 Classification Reflow Profiles Profile Feature Average ramp-up ...

Page 13

APM4550K Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness <2.5 mm 2.5 mm Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness <1.6 mm 1.6 mm – 2.5 mm 2.5 ...

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