SX-SDPGN-2830 Silex Technology, SX-SDPGN-2830 Datasheet

SX-SDPGN-2830

Manufacturer Part Number

SX-SDPGN-2830

Description

WiFi / 802.11 Modules 802.11b/g/n single band surface mount

Manufacturer

Silex Technology

Datasheet

1.SX-SDPGN-2830.pdf (2 pages)

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SX-SDPGN

802.11b/g/n SiP for Mobile Applications

The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third-

generation Wireless LAN solution, featuring 802.11n. Based on the

game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings

802.11n throughput, range and power e ciency to portable

devices including patient monitors, printers, handheld terminals

and more.

The SX-SDPGN is ideal for high volume Wireless LAN applications.

The SX-SDPGN is a System-in-Package (SiP) designed to be

mounted directly on the device PCBA. This design approach

minimizes cost by eliminating extra materials (i.e. PCB and

connectors) and labor associated with a radio module or card.

Bene ts:

•

Solution Highlights:

The SX-SDPGN incorporates all the features and performance of the

award winning Qualcomm Atheros ROCm® AR6003 solution, including:

•

Lowest Cost 802.11n Wireless LAN Solution

High RBOM integration enables design exibility and lowest cost

Smallest foot print for space constrained devices

Direct antenna connection eliminates the need for complicated

RF tuning and calibration

Single-stream 802.11n for faster downloads, longer range, and

lower power consumption

The highest actual end-user throughput-over-range utilizing

advanced 802.11n features including: full & half guard interval,

hardware acelerated frame aggregation, space time block

coding (STBC), and low density parity check (LDPC) encoding

Highest level of on-chip integration using CMOS technology

- Radio/MAC/Baseband

- Patented Qualcomm Atheros E cient Power Ampli er

- Integrated power management unit

Direct Connect™ AP Mode technology

Qualcomm Atheros Universal Wireless Cooperation for

enhanced Wireless/Bluetooth Cooperation

(EPA

) for high transmitter output power

Features:

•

Speci cations:

Target Applications:

The SX-SDPGN is ideal for any high volume portable device

where there is a requirement to achieve the lowest BOM cost

or smallest foot print. Implementation of a System-in-Package

solution is recommended for companies that have RF hardware

expertise. Software driver and supplicant development is also

generally required.

Chipset

Operating Voltage

Dimensions

Product Name

Storage Temperature

Operating Temperature

IEEE 802.11b/g/n 2.4 GHz

Integrated CMOS E cient Power Ampli er (EPA™), LNA

Adaptive radio biasing for low-power or high-performance modes

Industry-leading receive sensitivity

No external EEPROM required for RF calibration

Integrated RISC processor

Support for industry standard QoS schemes

(802.11e, WMM, WMM-PS)

Hardware accelerated security, including WAPI (China)

SX-SDPGN-2830

Qualcomm Atheros AR6103

VDD 3.3V, AVDD 1.8v

8.3 x 9.2 x 1.015 mm

-45 to +135 degrees C

-20 to +85 degrees C

PN: 141-00207-100

REV C. 20120918

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SX-SDPGN-2830 Summary of contents

Page 1

... BOM cost or smallest foot print. Implementation of a System-in-Package solution is recommended for companies that have RF hardware expertise. Software driver and supplicant development is also generally required. Speci cations: Product Name SX-SDPGN-2830 Chipset Qualcomm Atheros AR6103 Operating Voltage VDD 3.3V, AVDD 1.8v Dimensions 8.3 x 9.2 x 1.015 mm ...

Page 2

... System in Package (SiP) Interfaces Communications: Supported Data Rate: IEEE 802.11b IEEE 802.11g IEEE 802.11n Bluetooth Coexistence Physical Speci cations Ordering Information SX-SDPGN-2830: SX-SDPGN-2830-SP: SX-6K3-EVK-SB: Corporate Headquarters Europe O ce silex technology, Inc. silex technology europe, GmbH +81-774-98-3781 +49-2159-65009-0 www.silex.jp www.silexeurope.com support@silex.jp contact@silexeurope ...

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