MCIMX6S6AVM08AB Freescale Semiconductor, MCIMX6S6AVM08AB Datasheet

MCIMX6S6AVM08AB

Manufacturer Part Number

MCIMX6S6AVM08AB

Description

Processors - Application Specialized i.MX6 Solo rev 1.1

Manufacturer

Freescale Semiconductor

Type

Automotive and Infotainment Processorsr

Datasheet

1.MCIMX6S6AVM08AB.pdf (174 pages)

Specifications of MCIMX6S6AVM08AB

Rohs

yes

Core

ARM Cortex A9

Processor Series

i.MX6

Data Bus Width

32 bit

Maximum Clock Frequency

800 MHz

Instruction / Data Cache Memory

32 KB

Data Ram Size

128 KB

Data Rom Size

96 KB

Operating Supply Voltage

1.5 V

Maximum Operating Temperature

+ 125 C

Mounting Style

SMD/SMT

Package / Case

BGA 2240

Interface Type

I2S, SSI, AC97, ESAI, UARTS, eCSPI, I2C, Ethernet, PWM, SJC, GPIO, KPP, SPDIF

Memory Type

DDR3

Minimum Operating Temperature

- 40 C

Number Of Timers

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

BOSTOCK HK LIMITED

Part Number:

MCIMX6S6AVM08AB

Manufacturer:

Freescale Semiconductor

Quantity:

10 000

Company:

Meier Automation Equipment Co., Limited

Part Number:

MCIMX6S6AVM08AB

Manufacturer:

FREESCALE

Quantity:

20 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MCIMX6S6AVM08ABR

Manufacturer:

FSC

Quantity:

200

Current page: 1 of 174
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i.MX 6Solo/6DualLite

Automotive and

Infotainment

Applications Processors

Freescale Semiconductor

Data Sheet: Technical Data

The i.MX 6Solo/6DualLite automotive and infotainment

processors represent Freescale Semiconductor’s latest

achievement in integrated multimedia-focused products

offering high-performance processing with a high degree

of functional integration. These processors are designed

considering the needs of the growing automotive

infotainment, telematics, HMI, and display-based cluster

markets.

The processors feature Freescale’s advanced

implementation of single/dual ARM Cortex™-A9 core,

which operates at speeds of up to 800 MHz. They

include 2D and 3D graphics processors, 1080p video

processing, and integrated power management. Each

processor provides a 32/64-bit

DDR3/LVDDR3/LPDDR2-800 memory interface and a

number of other interfaces for connecting peripherals,

Introduction

1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 22

5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . 144

6. Package Information and Contact Assignments . . . . . 147

7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173

1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3

1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1. Special Signal Considerations . . . . . . . . . . . . . . . 19

3.2. Recommended Connections for Unused Analog

4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 22

4.2. Power Supplies Requirements and Restrictions . 31

4.3. Integrated LDO Voltage Regulator Parameters . . 32

4.4. PLL’s Electrical Characteristics . . . . . . . . . . . . . . 34

4.5. On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . 36

4.6. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . 37

4.7. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . 41

4.8. Output Buffer Impedance Parameters . . . . . . . . . 46

4.9. System Modules Timing . . . . . . . . . . . . . . . . . . . 49

4.10. General-Purpose Media Interface (GPMI) Timing 67

4.11. External Peripheral Interface Parameters . . . . . . 77

5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 144

5.2. Boot Device Interface Allocation . . . . . . . . . . . . 146

6.1. 21x21 mm Package Information . . . . . . . . . . . . 147

BGA Case 2240 21 x 21 mm, 0.8 mm pitch

Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Document Number: IMX6SDLAEC

Package Information

Ordering Information

See

MCIMX6SxAxxxxxB

MCIMX6UxAxxxxxB

Plastic Package

Table 1 on page 3

Rev. 1, 11/2012

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