IS61C1024AL-12TLI ISSI, Integrated Silicon Solution Inc, IS61C1024AL-12TLI Datasheet - Page 12

IC SRAM 1MBIT 12NS 32TSOP

IS61C1024AL-12TLI

Manufacturer Part Number
IS61C1024AL-12TLI
Description
IC SRAM 1MBIT 12NS 32TSOP
Manufacturer
ISSI, Integrated Silicon Solution Inc
Datasheet

Specifications of IS61C1024AL-12TLI

Format - Memory
RAM
Memory Type
SRAM - Asynchronous
Memory Size
1M (128K x 8)
Speed
12ns
Interface
Parallel
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
32-TSOP
Density
1Mb
Access Time (max)
12ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
5V
Address Bus
17b
Package Type
TSOP-I
Operating Temp Range
-40C to 85C
Number Of Ports
1
Supply Current
40mA
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
32
Word Size
8b
Number Of Words
128K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
706-1087
IS61C1024AL-12TLI

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Plastic STSOP - 32 pins
Package Code: H (Type I)
Integrated Silicon Solution, Inc.
PK13197H32 Rev. B 04/21/03
PACKAGING INFORMATION
1
Ref. Std.
Symbol Min
D1
N
A1
A2
A
C
D
E
S
b
e
L
13.20 13.60
11.70 11.90
Millimeters
0.05
0.95
0.17
0.14
7.90
0.30
Plastic STSOP (H - Type I)
0.28 Typ.
0.50 BSC
Max
1.25
1.05
0.23
0.16
8.10
0.70
32
0.0055
0.002
0.037
0.007
0.520
0.461
0.311
0.012
Min
D1
0.020 BSC
0.011 Typ.
D
Inches
0.0063
0.049
0.041
0.009
0.535
0.469
0.319
0.028
Max
L
Notes:
1. Controlling dimension: millimeters, unless otherwise
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E do not include mold flash protru-
4. Formed leads shall be planar with respect to one another
N
specified.
sions and should be measured from the bottom of the package.
within 0.004 inches at the seating plane.
E
SEATING PLANE
A2
C
A
S
ISSI
A1
b
e
®

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