IS42S16400F-6TL ISSI, Integrated Silicon Solution Inc, IS42S16400F-6TL Datasheet - Page 20

IC SDRAM 64MBIT 166MHZ 54TSOP

IS42S16400F-6TL

Manufacturer Part Number
IS42S16400F-6TL
Description
IC SDRAM 64MBIT 166MHZ 54TSOP
Manufacturer
ISSI, Integrated Silicon Solution Inc
Type
SDRAMr
Datasheets

Specifications of IS42S16400F-6TL

Format - Memory
RAM
Memory Type
SDRAM
Memory Size
64M (4M x 16)
Speed
166MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-TSOP II
Organization
4Mx16
Density
64Mb
Address Bus
14b
Access Time (max)
6/5.4ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
130mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Data Bus Width
16 bit
Maximum Clock Frequency
166 MHz
Access Time
6 ns, 5.4 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Maximum Operating Current
130 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
706-1075
IS42S16400F-6TL

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IS42S16400F
IC42S16400F
READS
READ bursts are initiated with a READ command, as
shown in the READ COMMAND diagram.
The starting column and bank addresses are provided with
the READ command, and auto precharge is either enabled or
disabled for that burst access. If auto precharge is enabled,
the row being accessed is precharged at the completion of
the burst. For the generic READ commands used in the fol-
lowing illustrations, auto precharge is disabled.
During READ bursts, the valid data-out element from the
starting column address will be available following the
CAS latency after the READ command. Each subsequent
data-out element will be valid by the next positive clock
edge. The CAS Latency diagram shows general timing
for each possible CAS latency setting.
Upon completion of a burst, assuming no other commands
have been initiated, the DQs will go High-Z. A full-page burst
will continue until terminated. (At the end of the page, it will
wrap to column 0 and continue.)
Data from any READ burst may be truncated with a sub-
sequent READ command, and data from a fixed-length
READ burst may be immediately followed by data from a
READ command. In either case, a continuous flow of data
read accesses can be performed to the same bank, as
shown in Random READ Accesses, or each subsequent
READ may be performed to a different bank.
Data from any READ burst may be truncated with a sub-
sequent WRITE command, and data from a fixed-length
a single-cycle delay should occur between the last read
data and the WRITE command.
20
can be maintained. The first data element from the new
burst follows either the last element of a completed burst
or the last desired data element of a longer burst which
is being truncated.
The new READ command should be issued x cycles before
the clock edge at which the last desired data element is
valid, where x equals the CAS latency minus one. This is
shown in Consecutive READ Bursts for CAS latencies of
two and three; data element n + 3 is either the last of a
burst of four or the last desired of a longer burst.The 64Mb
SDRAM uses a pipelined architecture and therefore does
not require the 2n rule associated with a prefetch architec-
ture. A READ command can be initiated on any clock cycle
following a previous READ command. Full-speed random
READ burst may be immediately followed by data from a
WRITE command (subject to bus turnaround limitations).
The WRITE burst may be initiated on the clock edge im-
mediately following the last (or last desired) data element
from the READ burst, provided that I/O contention can be
avoided. In a given system design, there may be a pos-
sibility that the device driving the input data will go Low-Z
before the SDRAM DQs go High-Z. In this case, at least
READ COMMAND
The DQM input is used to avoid I/O contention, as shown
in Figures RW1 and RW2. The DQM signal must be as-
serted (HIGH) at least three clocks prior to the WRITE
command (DQM latency is two clocks for output buffers)
to suppress data-out from the READ. Once the WRITE
command is registered, the DQs will go High-Z (or remain
High-Z), regardless of the state of the DQM signal, provided
the DQM was active on the clock just prior to the WRITE
command that truncated the READ command. If not, the
second WRITE will be an invalid WRITE. For example, if
DQM was LOW during T4 in Figure RW2, then the WRITEs
at T5 and T7 would be valid, while the WRITE at T6 would
be invalid.
The DQM signal must be de-asserted prior to the WRITE
command (DQM latency is zero clocks for input buffers)
to ensure that the written data is not masked.
A fixed-length READ burst may be followed by, or truncated
with, a PRECHARGE command to the same bank (provided
that auto precharge was not activated), and a full-page burst
may be truncated with a PRECHARGE command to the
same bank.The PRECHARGE command should be issued
x cycles before the clock edge at which the last desired
data element is valid, where x equals the CAS latency
minus one. This is shown in the READ to PRECHARGE
A8, A9, A11
BA0, BA1
Integrated Silicon Solution, Inc. — www.issi.com
A0-A7
CKE
RAS
CAS
CLK
A10
WE
CS
HIGH-Z
AUTO PRECHARGE
COLUMN ADDRESS
NO PRECHARGE
BANK ADDRESS
03/19/08
Rev. A

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