W25Q80BVDAIG Winbond Electronics, W25Q80BVDAIG Datasheet - Page 73
W25Q80BVDAIG
Manufacturer Part Number
W25Q80BVDAIG
Description
SPI FLASH 8MBIT 8-DIP
Manufacturer
Winbond Electronics
Datasheet
1.W25Q80BVSSIG.pdf
(75 pages)
Specifications of W25Q80BVDAIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
8M (1M x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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12. ORDERING INFORMATION
Notes:
1. The “W” prefix is not included on the part marking.
2. Only the 2
3. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and
4. For shipments with OTP feature enabled, please specify when placing orders.
W = Winbond
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
80B = 8M-bit
V = 2.7V to 3.6V
SN = 8-pin SOIC 150-mil
DA = 8-pin PDIP 300-mil
A = Automotive (-40°C to +105°C)
G = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb
P
I = Industrial (-40°C to +85°C)
Reel (shape T) or Tray (shape S), when placing orders.
= Green Package with Status Register Power-Down & OTP enabled
nd
letter is used for the part marking; WSON package type ZP is not used for the part marking.
(3,4)
SS = 8-pin SOIC 208-mi
ZP
= 8-pad WSON 6x5-mm
- 73 -
W
(1)
Publication Release Date: October 06, 2010
25Q 80B V xx
2
W25Q80BV
O
3
)
(2)
Revision D
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