ISL8225MEVAL4Z Intersil, ISL8225MEVAL4Z Datasheet - Page 3

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ISL8225MEVAL4Z

Manufacturer Part Number
ISL8225MEVAL4Z
Description
Power Management IC Development Tools Dual 15A Output Eval Board
Manufacturer
Intersil
Type
DC/DC Converters, Regulators & Controllersr
Datasheet

Specifications of ISL8225MEVAL4Z

Rohs
yes
Product
Evaluation Boards
Tool Is For Evaluation Of
ISL8225M
Input Voltage
4.5 V to 20 V
Output Voltage
1.2 V, 1.5 V
Output Current
30 A
For Use With
ISL8225M
However, if the output voltage is increased or the board is
operated at elevated temperatures, then the available current is
derated. Refer to the derated current curves in the
determine the output current available.
For layout of designs using the ISL8225M, the thermal
performance can be improved by adhering to the following
design tips:
1. Use the top and bottom layers to carry the large current.
2. Phase 1 and Phase 2 pads are switching nodes that generate
3. Place the modules evenly on the board and leave enough
4. If the ambient temperature is high or the board space is
VOUT1, VOUT2, Phase 1, Phase 2, PGND, VIN1 and VIN2
should have large, solid planes. Place enough thermal vias to
connect the power planes in different layers under and
around the module.
switching noise. Keep these pads under the module. For
noise-sensitive applications, it is recommended to keep
phase pads only on the top and inner layers of the PCB; do not
place phase pads exposed to the outside on the bottom layer
of the PCB. To improve the thermal performance, the phase
pads can be extended in the inner layer, as shown in Phase 1
and Phase 2 pads on layer 2 (Figure 5) for this dual 15A
evaluation board. Make sure that layer 1 and layer 3 have the
GND layers to cover the extended areas of phase pads at
layer 2 to avoid noise coupling.
space between modules. If the board space is limited, try to
put the modules with low power loss closely together (i.e. low
V
loss.
limited, airflow is needed to dissipate more heat from the
modules. A heat sink can also be applied to the top side of the
module to further improve the thermal performance (heat
sink recommendation: Aavid Thermalloy, part number
375424B00034G, www.aavid.com).
OUT
or I
OUT
) while still separating the module with high power
3
Application Note 1793
datasheet
to
December 6, 2012
AN1793.1

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