ADP1607-001-EVALZ Analog Devices, ADP1607-001-EVALZ Datasheet - Page 4

• Manufacturer Part Number: ADP1607-001-EVALZ
• Description: Power Management IC Development Tools Eval Board PWM Mode Only
• Manufacturer: Analog Devices
• Type: DC/DC Converters, Regulators & Controllersr
• Series: ADP1607r

Specifications of ADP1607-001-EVALZ

• Rohs: yes
• Tool Is For Evaluation Of: ADP1607
• Input Voltage: 0.8 V to 3.3 V
• Factory Pack Quantity: 1

ADP1607
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VIN, VOUT to GND
FB to GND
EN, SW to GND (when VIN ≥ VOUT)
EN, SW to GND (when VIN < VOUT)
EPAD to GND
Operating Ambient Temperature Range
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination.
THERMAL OPERATING RANGES
The
ature limits are exceeded. The maximum operating junction
temperature (T
operating ambient temperature (T
temperature does not guarantee that the junction temperature
(T
In applications with high power dissipation and poor PCB
thermal resistance, the maximum ambient temperature may
need to be derated. In applications with moderate power
dissipation and low PCB thermal resistance, the maximum
ambient temperature can exceed the maximum limit as long
as the junction temperature is within specification limits.
J
) is within the specified temperature limits.
ADP1607
can be damaged when the junction temper-
J(MAX)
) takes precedence over the maximum
A(MAX)
). Monitoring ambient
Rating
−0.3 V to +3.6 V
−0.3 V to +1.4 V
−0.3 V to VIN + 0.3 V
−0.3 V to VOUT + 0.3 V
−0.3 V to + 0.3 V
−40°C to +85°C
−40°C to +90°C
−65°C to +150°C
JEDEC J-STD-020
Rev. A | Page 4 of 16
The junction temperature T
ambient temperature (T
(P
package (θ
from the ambient temperature (T
using the following formula:
THERMAL RESISTANCE
Junction-to-ambient thermal resistance (θ
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. The
junction-to-ambient thermal resistance is highly dependent
on the application and board layout. In applications where high
maximum power dissipation exists, attention to thermal board
design is required. The value of θ
PCB material, layout, and environmental conditions.
θ
JESD51-9 on a 4-layer PCB with natural convection cooling
and the exposed pad soldered to the board with thermal vias.
Table 3.
Package Type
6-Lead LFCSP
ESD CAUTION
JA
D
), and the junction-to-ambient thermal resistance of the
and θ
T
J
= T
JC
JA
A
(junction to case) are determined according to
). Maximum junction temperature (T
+ (P
D
× θ
JA
)
A
), the power dissipation of the device
J
of the device is dependent on the
θ
66.06
JA
A
JA
) and power dissipation (P
may vary, depending on
JA
θ
4.3
) of the package
JC
Data Sheet
J
) is calculated
Unit
°C/W
D
)