MT48LC2M32B2P-5:G Micron Technology Inc, MT48LC2M32B2P-5:G Datasheet - Page 44

• Manufacturer Part Number: MT48LC2M32B2P-5:G
• Description: IC SDRAM 64MBIT 200MHZ 86TSOP
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC2M32B2P-5:G

• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 64M (2Mx32)
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 86-TSOP
• Organization: 2Mx32
• Density: 64Mb
• Address Bus: 13b
• Access Time (max): 4.5ns
• Maximum Clock Rate: 200MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 280mA
• Pin Count: 86
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Package: 86TSOP-II
• Address Bus Width: 13 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 4.5 ns
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 12:
Table 13:
PDF: 09005aef811ce1fe/Source: 09005aef811ce1d5
64MSDRAMx32_2.fm - Rev. J 12/08 EN
Revision
Die
G
Temperature Limits
Thermal Impedance Simulated Values
Package
90-ball
86-pin
FBGA
TSOP
Notes:
Notes:
Substrate
1. MAX operating case temperature, T
2. Device functionality is not guaranteed if the device exceeds maximum T
3. All temperature specifications must be satisfied.
4. The case temperature should be measured by gluing a thermocouple to the top center of
5. Operating ambient temperature surrounding the package.
1. For designs expected to last beyond the die revision listed, contact Micron Applications
2. Thermal resistance data is sampled from multiple lots and the values should be viewed as
3. These are estimates; actual results may vary.
Parameter
Operating case temperature:
Commercial
Industrial
Automotive
Junction temperature:
Commercial
Industrial
Automotive
Ambient temperature:
Commercial
Industrial
Automotive
Peak reflow temperature
4-layer
2-layer
4-layer
side of the device, as shown in Figures 31 and 32 on page 45.
the component. This should be done with a 1mm bead of conductive epoxy, as defined by
the JEDEC EIA/JESD51 standards. Care should be taken to ensure the thermocouple bead is
touching the case.
Engineering to confirm thermal impedance values.
typical.
Airflow = 0m/s
θ JA (°C/W)
66.6
70.6
54
44
Airflow = 1m/s
θ JA (°C/W)
Symbol
C
57.7
57.6
47.3
T
, is measured in the center of the package on the top
PEAK
T
T
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T
A
C
J
Min
Airflow = 2m/s
–40
–40
–40
–40
–40
–40
0
0
0
–
θ JA (°C/W)
54.6
69.5
52.7
Electrical Specifications
Max
105
110
105
260
80
90
85
95
70
85
©2001 Micron Technology, Inc. All rights reserved.
64Mb: x32 SDRAM
(°C/W)
θ JB
53.6
35.7
35.2
Units
C
°C
°C
°C
°C
during operation.
1, 2, 3, 4
(°C/W)
Notes
12.7
7.95
θ JC
3, 5
3