MT48LC2M32B2P-5:G Micron Technology Inc, MT48LC2M32B2P-5:G Datasheet - Page 69

• Manufacturer Part Number: MT48LC2M32B2P-5:G
• Description: IC SDRAM 64MBIT 200MHZ 86TSOP
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC2M32B2P-5:G

• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 64M (2Mx32)
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 86-TSOP
• Organization: 2Mx32
• Density: 64Mb
• Address Bus: 13b
• Access Time (max): 4.5ns
• Maximum Clock Rate: 200MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 280mA
• Pin Count: 86
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Package: 86TSOP-II
• Address Bus Width: 13 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 4.5 ns
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 51:
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although
PDF: 09005aef811ce1fe/Source: 09005aef811ce1d5
64MSDRAMx32_2.fm - Rev. J 12/08 EN
considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø0.42
90X Ø0.45 ±0.05
SEATING PLANE
11.20 ±0.10
0.10 C
90-Ball VFBGA (8mm x 13mm)
BALL A9
5.60 ±0.05
Notes:
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
C
0.65 ±0.05
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. Recommended pad size for PCB is 0.33mm ±0.025mm.
4. Topside part marking decoder can be found at:
www.micron.com/productsupport Customer Comment Line: 800-932-4992
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
3.20 ±0.05
0.025mm per side.
tools/fbga/decoder.
All other trademarks are the property of their respective owners.
8.00 ±0.10
6.40
C L
4.00 ±0.05
0.80 TYP
C L
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
69
13.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
www.micron.com/support/designsupport/
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
SOLDER MASK DEFINED BALL PADS: Ø0.40
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
Package Dimensions
©2001 Micron Technology, Inc. All rights reserved.
64Mb: x32 SDRAM
BALL A1 ID