MT48LC8M16A2P-75:G Micron Technology Inc, MT48LC8M16A2P-75:G Datasheet - Page 31

IC SDRAM 128MBIT 133MHZ 54TSOP

MT48LC8M16A2P-75:G

Manufacturer Part Number
MT48LC8M16A2P-75:G
Description
IC SDRAM 128MBIT 133MHZ 54TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr

Specifications of MT48LC8M16A2P-75:G

Memory Type
SDRAM
Format - Memory
RAM
Memory Size
128M (8Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-TSOP II
Memory Configuration
16M X 8
Access Time
5.4ns
Page Size
128Mbit
Memory Case Style
TSOP
No. Of Pins
54
Operating Temperature Range
0°C To +70°C
Organization
8Mx16
Density
128Mb
Address Bus
14b
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
150mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC8M16A2P-75:G
Manufacturer:
MICRON
Quantity:
8
Part Number:
MT48LC8M16A2P-75:G
Manufacturer:
MICRON
Quantity:
8 000
Part Number:
MT48LC8M16A2P-75:G
Manufacturer:
MICRON
Quantity:
20 000
Figure 18:
WRITEs
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
Terminating a READ Burst
Notes:
COMMAND
COMMAND
1. DQM is LOW.
WRITE bursts are initiated with a WRITE command, as shown in Figure 19 on page 32.
auto precharge either is enabled or disabled for that access. If auto precharge is enabled,
the row being accessed is precharged at the completion of the burst. For the generic
WRITE commands used in the following illustrations, auto precharge is disabled.
During WRITE bursts, the first valid data-in element will be registered coincident with
the WRITE command. Subsequent data elements will be registered on each successive
positive clock edge. Upon completion of a fixed-length burst, assuming no other
commands have been initiated, the DQ will remain High-Z and any additional input
data will be ignored (see Figure 20 on page 32). A full-page burst will continue until
terminated. (At the end of the page, it will wrap to column 0 and continue.)
The starting column and bank addresses are provided with the WRITE command, and
ADDRESS
ADDRESS
CLK
CLK
DQ
DQ
BANK,
T0
COL n
T0
BANK,
COL n
READ
READ
CL = 2
T1
T1
NOP
NOP
CL = 3
31
T2
T2
NOP
NOP
D
OUT
n
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T3
T3
NOP
NOP
n + 1
D
D
OUT
OUT
n
TRANSITIONING DATA
TERMIN ATE
TERMIN ATE
T4
BURST
BURST
T4
X = 1 cycle
n + 2
D
n + 1
D
OUT
OUT
128Mb: x4, x8, x16 SDRAM
X = 2 cycles
T5
T5
NOP
NOP
n + 3
n + 2
D
D
OUT
OUT
©1999 Micron Technology, Inc. All rights reserved.
T6
T6
NOP
NOP
n + 3
D
OUT
DON’T CARE
Operations
T7
NOP

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