MT48LC8M16A2P-75:G Micron Technology Inc, MT48LC8M16A2P-75:G Datasheet - Page 32

IC SDRAM 128MBIT 133MHZ 54TSOP

MT48LC8M16A2P-75:G

Manufacturer Part Number
MT48LC8M16A2P-75:G
Description
IC SDRAM 128MBIT 133MHZ 54TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr

Specifications of MT48LC8M16A2P-75:G

Memory Type
SDRAM
Format - Memory
RAM
Memory Size
128M (8Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-TSOP II
Memory Configuration
16M X 8
Access Time
5.4ns
Page Size
128Mbit
Memory Case Style
TSOP
No. Of Pins
54
Operating Temperature Range
0°C To +70°C
Organization
8Mx16
Density
128Mb
Address Bus
14b
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
150mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC8M16A2P-75:G
Manufacturer:
MICRON
Quantity:
8
Part Number:
MT48LC8M16A2P-75:G
Manufacturer:
MICRON
Quantity:
8 000
Part Number:
MT48LC8M16A2P-75:G
Manufacturer:
MICRON
Quantity:
20 000
Figure 19:
Figure 20:
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
WRITE Command
WRITE Burst
Notes:
A0–A9, A11: x4
COMMAND
1. BL = 2. DQM is LOW.
Data for any WRITE burst may be truncated with a subsequent WRITE command, and
data for a fixed-length WRITE burst may be immediately followed by data for a WRITE
command. The new WRITE command can be issued on any clock following the previous
WRITE command, and the data provided coincident with the new command applies to
the new command. An example is shown in Figure 21 on page 33. Data n + 1 is either the
last of a burst of two or the last desired element of a longer burst. The 128Mb SDRAM
uses a pipelined architecture and, therefore, does not require the 2n rule associated with
ADDRESS
A9, A11: x16
A0–A9: x8
A0–A8: x16
BA0, BA1
A11: x8
CLK
DQ
RAS#
CAS#
WE#
CKE
A10
CLK
CS#
WRITE
BANK,
COL n
TRANSITIONING DATA
T0
D
n
IN
HIGH
NOP
n + 1
T1
D
IN
DISABLE AUTO PRECHARGE
ENABLE AUTO PRECHARGE
32
NOP
ADDRESS
COLUMN
ADDRESS
T2
BANK
DON’T CARE
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DON’T CARE
T3
NOP
128Mb: x4, x8, x16 SDRAM
©1999 Micron Technology, Inc. All rights reserved.
Operations

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