MT48LC8M16A2P-75:G Micron Technology Inc, MT48LC8M16A2P-75:G Datasheet - Page 52

• Manufacturer Part Number: MT48LC8M16A2P-75:G
• Description: IC SDRAM 128MBIT 133MHZ 54TSOP
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC8M16A2P-75:G

• Memory Type: SDRAM
• Format - Memory: RAM
• Memory Size: 128M (8Mx16)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 54-TSOP II
• Memory Configuration: 16M X 8
• Access Time: 5.4ns
• Page Size: 128Mbit
• Memory Case Style: TSOP
• No. Of Pins: 54
• Operating Temperature Range: 0°C To +70°C
• Organization: 8Mx16
• Density: 128Mb
• Address Bus: 14b
• Access Time (max): 6/5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 150mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Compliant, Lead free / RoHS Compliant

PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
12. Other input signals are allowed to transition no more than once every 2 clocks and are
13. I
14. Timing actually specified by
15. Timing actually specified by
16. Timing actually specified by
17. Required clocks are specified by JEDEC functionality and are not dependent on any
18. The I
19. Address transitions average one transition every 2 clocks.
20. CLK must be toggled a minimum of two times during this period.
21. Based on
22. V
23. The clock frequency must remain constant (stable clock is defined as a signal cycling
24. Auto precharge mode only. The precharge timing budget (
25. Precharge mode only.
26. JEDEC and PC100 specify 3 clocks.
27.
28. Parameter guaranteed by design.
29. PC100 specifies a maximum of 4pF.
30. PC100 specifies a maximum of 5pF.
31. PC100 specifies a maximum of 6.5pF.
32. For -75, CL = 3 and
33. CKE is HIGH during refresh command period
34. PC133 specifies a minimum of 2.5pF.
35. PC133 specifies a minimum of 2.5pF.
36. PC133 specifies a minimum of 3.0pF.
otherwise at valid V
cycle rate.
minimum cycle rate.
timing parameter.
frequency alteration for the test condition.
cannot be greater than one-third of the cycle rate. V
a pulse width
within timing constraints specified for the clock pin) during access or precharge
states (READ, WRITE, including
used to reduce the data rate.
for -7E, and 7.5ns for -75 after the first clock delay, after the last WRITE is executed.
t
6ns.
limit is actually a nominal value and does not result in a fail value.
DD
AC for -75/-7E at CL = 3 with no load is 4.6ns and is guaranteed by design.
IH
specifications are tested after the device is properly initialized.
overshoot: V
DD
current will increase or decrease proportionally according to the amount of
t
CK = 7.5ns for -75/-7E, and
≤
3ns.
IH
(MAX) = V
t
IH
CK = 7.5ns; for -7E, CL = 2 and
or V
IL
52
levels.
t
t
t
CKS; clock(s) specified as a reference only at minimum
WR plus
WR.
DD
Q + 2V for a pulse width
t
WR, and PRECHARGE commands). CKE may be
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
t
CK = 6ns for -6A.
RP; clock(s) specified as a reference only at
t
RFC (MIN) else CKE is LOW. The I
t
128Mb: x4, x8, x16 SDRAM
CK = 7.5ns, and CL = 3 and
IL
undershoot: V
≤
3ns, and the pulse width
t
RP) begins 6ns for -6A, 7ns
©1999 Micron Technology, Inc. All rights reserved.
IL
(MIN) = –2V for
Notes
t
CK =
DD
6