MT48LC16M8A2P-75:G Micron Technology Inc, MT48LC16M8A2P-75:G Datasheet - Page 46

IC SDRAM 128MBIT 133MHZ 54TSOP

MT48LC16M8A2P-75:G

Manufacturer Part Number
MT48LC16M8A2P-75:G
Description
IC SDRAM 128MBIT 133MHZ 54TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC16M8A2P-75:G

Format - Memory
RAM
Memory Type
SDRAM
Memory Size
128M (16M x 8)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-TSOP II
Organization
16Mx8
Density
128Mb
Address Bus
14b
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
150mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC16M8A2P-75:G
Manufacturer:
ST
Quantity:
2 000
Part Number:
MT48LC16M8A2P-75:G
Manufacturer:
MICRON/美光
Quantity:
230
Electrical Specifications
Table 11:
Temperature and Thermal Impedance
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
Parameter
Voltage on V
Voltage on inputs, NC or I/O pins relative to V
Operating temperature
T
T
T
Storage temperature (plastic)
Power dissipation
A
A
A
(commercial)
(industrial)
(automotive)
DD
Absolute Maximum Ratings
/V
DD
Q supply relative to V
Stresses greater than those listed in Table 11 may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at these or any
other conditions above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may
affect reliability.
It is imperative that the SDRAM device’s temperature specifications, shown in Table 12
on page 47, be maintained to ensure the junction temperature is in the proper operating
range to meet data sheet specifications. An important step in maintaining the proper
junction temperature is using the device’s thermal impedances correctly. The thermal
impedances are listed in Table 13 on page 47 for the applicable die revision and pack-
ages being made available. These thermal impedance values vary according to the
density, package, and particular design used for each device.
Incorrectly using thermal impedances can produce significant errors. Read Micron tech-
nical note TN-00-08, “Thermal Applications” prior to using the thermal impedances
listed in Table 13. To ensure the compatibility of current and future designs, contact
Micron Applications Engineering to confirm thermal impedance values.
The SDRAM device’s safe junction temperature range can be maintained when the T
specification is not exceeded. In applications where the device’s ambient temperature is
too high, use of forced air and/or heat sinks may be required to satisfy the case tempera-
ture specifications.
SS
SS
46
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Min
–40
–40
–55
128Mb: x4, x8, x16 SDRAM
–1
–1
0
Electrical Specifications
1
©1999 Micron Technology, Inc. All rights reserved.
+105
+150
Max
+4.6
+4.6
+70
+85
Rating
°C
°C
W
V
V
C

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