MT48LC32M8A2P-7E:D Micron Technology Inc, MT48LC32M8A2P-7E:D Datasheet - Page 52

• Manufacturer Part Number: MT48LC32M8A2P-7E:D
• Description: IC SDRAM 256MBIT 133MHZ 54TSOP
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC32M8A2P-7E:D

• Package / Case: 54-TSOP II
• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 256M (32M x 8)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Access Time: RoHS Compliant
• Memory Case Style: TSOP
• No. Of Pins: 54
• Operating Temperature Range: 0°C To +70°C
• Operating Temperature Max: 70°C
• Operating Temperature Min: 0°C
• Organization: 32Mx8
• Density: 256Mb
• Address Bus: 15b
• Access Time (max): 5.4ns
• Maximum Clock Rate: 143MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 135mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Memory Configuration: 4 BLK (8M X 8)
• Interface Type: LVTTL
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

READ Operation
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
READ bursts are initiated with a READ command, as shown in Figure 14 (page 34). The
starting column and bank addresses are provided with the READ command, and auto
precharge is either enabled or disabled for that burst access. If auto precharge is ena-
bled, the row being accessed is precharged at the completion of the burst. In the
following figures, auto precharge is disabled.
During READ bursts, the valid data-out element from the starting column address is
available following the CAS latency after the READ command. Each subsequent data-
out element will be valid by the next positive clock edge. Figure 22 (page 54) shows
general timing for each possible CAS latency setting.
Upon completion of a burst, assuming no other commands have been initiated, the DQ
signals will go to High-Z. A continuous page burst continues until terminated. At the
end of the page, it wraps to column 0 and continues.
Data from any READ burst can be truncated with a subsequent READ command, and
data from a fixed-length READ burst can be followed immediately by data from a READ
command. In either case, a continuous flow of data can be maintained. The first data
element from the new burst either follows the last element of a completed burst or the
last desired data element of a longer burst that is being truncated. The new READ com-
mand should be issued x cycles before the clock edge at which the last desired data
element is valid, where x = CL - 1. This is shown in Figure 22 (page 54) for CL2 and CL3.
SDRAM devices use a pipelined architecture and therefore do not require the 2n rule
associated with a prefetch architecture. A READ command can be initiated on any clock
cycle following a READ command. Full-speed random read accesses can be performed
to the same bank, or each subsequent READ can be performed to a different bank.
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 SDRAM
© 1999 Micron Technology, Inc. All rights reserved.
READ Operation