MT48LC32M8A2P-7E:D Micron Technology Inc, MT48LC32M8A2P-7E:D Datasheet - Page 81

IC SDRAM 256MBIT 133MHZ 54TSOP

MT48LC32M8A2P-7E:D

Manufacturer Part Number
MT48LC32M8A2P-7E:D
Description
IC SDRAM 256MBIT 133MHZ 54TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC32M8A2P-7E:D

Package / Case
54-TSOP II
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
256M (32M x 8)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Access Time
RoHS Compliant
Memory Case Style
TSOP
No. Of Pins
54
Operating Temperature Range
0°C To +70°C
Operating Temperature Max
70°C
Operating Temperature Min
0°C
Organization
32Mx8
Density
256Mb
Address Bus
15b
Access Time (max)
5.4ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Memory Configuration
4 BLK (8M X 8)
Interface Type
LVTTL
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
AUTO REFRESH Operation
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
The AUTO REFRESH command is used during normal operation of the device to refresh
the contents of the array. This command is nonpersistent, so it must be issued each
time a refresh is required. All active banks must be precharged prior to issuing an AUTO
REFRESH command. The AUTO REFRESH command should not be issued until the min-
imum
internal refresh controller. This makes the address bits “Don’t Care” during an AUTO
REFRESH command.
After the AUTO REFRESH command is initiated, it must not be interrupted by any exe-
cutable command until
NOP commands must be issued on each positive edge of the clock. The SDRAM re-
quires that every row be refreshed each
REFRESH command—calculated by dividing the refresh period (
rows to be refreshed—meets the timing requirement and ensures that each row is re-
freshed. Alternatively, to satisfy the refresh requirement a burst refresh can be em-
ployed after every
the number of rows to be refreshed at the minimum cycle rate (
t
RP is met following the PRECHARGE command. Addressing is generated by the
t
REF period by issuing consecutive AUTO REFRESH commands for
t
RFC has been met. During
81
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
REF period. Providing a distributed AUTO
256Mb: x4, x8, x16 SDRAM
t
RFC time, COMMAND INHIBIT or
AUTO REFRESH Operation
© 1999 Micron Technology, Inc. All rights reserved.
t
RFC).
t
REF) by the number of

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