MT48LC32M8A2P-7E:D Micron Technology Inc, MT48LC32M8A2P-7E:D Datasheet - Page 90

IC SDRAM 256MBIT 133MHZ 54TSOP

MT48LC32M8A2P-7E:D

Manufacturer Part Number
MT48LC32M8A2P-7E:D
Description
IC SDRAM 256MBIT 133MHZ 54TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC32M8A2P-7E:D

Package / Case
54-TSOP II
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
256M (32M x 8)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Access Time
RoHS Compliant
Memory Case Style
TSOP
No. Of Pins
54
Operating Temperature Range
0°C To +70°C
Operating Temperature Max
70°C
Operating Temperature Min
0°C
Organization
32Mx8
Density
256Mb
Address Bus
15b
Access Time (max)
5.4ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Memory Configuration
4 BLK (8M X 8)
Interface Type
LVTTL
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Rev. K – 2/07
Rev. K – 6/06
Rev. J – 3/05
Rev. H – 2/05
Rev. H – 10/04
Rev. G – 8/03
Rev. F – 1/03
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
• Reworded table sub-title notes for DC Electrical Characteristics and Operating Char-
• Moved AC Functional Characteristics (-6A) table from addendum to Electrical Specifi-
• Reworded table sub-title notes for AC Functional Characteristics (-6A) and AC Func-
• Corrected MDM numbers.
• Re-created PDF; text in the .fm file did not show in the PDF.
• Updated template.
• Removed PC66.
• Added -6A.
• Deleted note "contact factory for availability" from Options.
• Corrected "Bank 1" to "Bank 3," then-page 49.
• Added Die Revision to Options.
• Changed package drawing for the Y16A to Y16Y cross over, then-page 61.
• Change blue and green color to match.
• Added Pb-free packages to front page.
• Added Pb part numbers to then-page 4.
• Changed wording to V
• Added Note 3 to Self Refresh Mode on then-page 53.
• Added Note 3 to package drawings on then-pages 60 and 61.
• Corrected E2 by removing sv on then-page 3.
• Corrected 54-ball pins G3, H9, G2, and G1 on then-page 10.
• Added transitioning data to DQ lines in Figures 7-27 on then-pages 20-30.
• Added note 37 to then-page 39.
• Updated mech drawing for 54-pin TSOP on then-page 59.
• Update mech drawing for FG Package on then-page 61.
acteristics, I
(-7E, -75), Capacitance, Electrical Characteristics and Recommended AC Operating
Conditions (-6A), and Electrical Characteristics and Recommended AC Operating Con-
ditions (-7E, -75) tables.
cations section.
tional Characteristics (-7E, -75) tables.
DD
Specifications and Conditions (-6A), I
DDQ
and V
90
SSQ
on then-pages 10 and 11.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 SDRAM
DD
Specifications and Conditions
© 1999 Micron Technology, Inc. All rights reserved.
Revision History

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