MT48LC4M32B2P-6:G Micron Technology Inc, MT48LC4M32B2P-6:G Datasheet - Page 37

IC SDRAM 128MBIT 167MHZ 86TSOP

MT48LC4M32B2P-6:G

Manufacturer Part Number
MT48LC4M32B2P-6:G
Description
IC SDRAM 128MBIT 167MHZ 86TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC4M32B2P-6:G

Package / Case
86-TSOPII
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
128M (4Mx32)
Speed
167MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Access Time
RoHS Compliant
Memory Case Style
TSOP
No. Of Pins
86
Operating Temperature Range
0°C To +70°C
Operating Temperature Max
70°C
Operating Temperature Min
0°C
Organization
4Mx32
Density
128Mb
Address Bus
14b
Access Time (max)
17/7.5/5.5ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
195mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Memory Configuration
4 BLK (1M X 32)
Interface Type
LVTTL
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Table 9:
PDF: 09005aef80872800/Source: 09005aef80863355
128MbSDRAMx32_2.fm - Rev. L 1/09 EN
CKE
H
H
L
L
n-1
CKE
H
H
Truth Table – CKE
Notes 1–4 apply to the entire table
L
L
n
Notes:
Reading or writing
Current State
Clock suspend
Clock suspend
All banks idle
All banks idle
Power-down
Power-down
Self refresh
Self refresh
1. CKE
2. Current state is the state of the SDRAM immediately prior to clock edge n.
3. COMMAND
4. All states and sequences not shown are illegal or reserved.
5. Exiting power-down at clock edge n will put the device in the all banks idle state in time for
6. Exiting self refresh at clock edge n will put the device in the all banks idle state once
7. After exiting clock suspend at clock edge n, the device will resume operation and recognize
clock edge.
MAND
clock edge n + 1 (provided that
met. COMMAND INHIBIT or NOP commands should be issued on any clock edges occurring
during the
period.
the next command at clock edge n + 1.
n
is the logic state of CKE at clock edge n; CKE
n
.
t
n
XSR period. A minimum of two NOP commands must be provided during
is the command registered at clock edge n, and ACTION
COMMAND INHIBIT or NOP
COMMAND INHIBIT or NOP
COMMAND INHIBIT or NOP
See Table 10 on page 38
AUTO REFRESH
WRITE or NOP
COMMAND
37
X
X
X
X
t
CKS is met).
n
Micron Technology, Inc., reserves the right to change products or specifications without notice.
n-1
Maintain clock suspend
was the state of CKE at the previous
Maintain power-down
Maintain self refresh
Clock suspend entry
Power-down entry
Exit clock suspend
Exit power-down
self refresh entry
Exit self refresh
ACTION
©2001 Micron Technology, Inc. All rights reserved.
128Mb: x32 SDRAM
Register Definition
n
n
is a result of COM-
Notes
t
XSR is
t
5
6
7
XSR

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