MT48LC4M32B2P-6:G Micron Technology Inc, MT48LC4M32B2P-6:G Datasheet - Page 41

IC SDRAM 128MBIT 167MHZ 86TSOP

MT48LC4M32B2P-6:G

Manufacturer Part Number
MT48LC4M32B2P-6:G
Description
IC SDRAM 128MBIT 167MHZ 86TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC4M32B2P-6:G

Package / Case
86-TSOPII
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
128M (4Mx32)
Speed
167MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Access Time
RoHS Compliant
Memory Case Style
TSOP
No. Of Pins
86
Operating Temperature Range
0°C To +70°C
Operating Temperature Max
70°C
Operating Temperature Min
0°C
Organization
4Mx32
Density
128Mb
Address Bus
14b
Access Time (max)
17/7.5/5.5ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
195mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Memory Configuration
4 BLK (1M X 32)
Interface Type
LVTTL
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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PDF: 09005aef80872800/Source: 09005aef80863355
128MbSDRAMx32_2.fm - Rev. L 1/09 EN
10. For a READ without auto precharge interrupted by a READ (with or without auto pre-
11. For a READ without auto precharge interrupted by a WRITE (with or without auto pre-
12. For a WRITE without auto precharge interrupted by a READ (with or without auto pre-
13. For a WRITE without auto precharge interrupted by a WRITE (with or without auto pre-
14. For a READ with auto precharge interrupted by a READ (with or without auto precharge),
15. For a READ with auto precharge interrupted by a WRITE (with or without auto precharge),
16. For a WRITE with auto precharge interrupted by a READ (with or without auto precharge),
17. For a WRITE with auto precharge interrupted by a WRITE (with or without auto precharge),
6. All states and sequences not shown are illegal or reserved.
7. READs or WRITEs to bank m listed in the Command (Action) column include READs or
8. Concurrent auto precharge: Bank n will initiate the auto precharge command when its
9. Burst in bank n continues as initiated.
WRITEs with auto precharge enabled and READs or WRITEs with auto precharge disabled.
burst has been interrupted by bank m’s burst.
charge), the READ to bank m will interrupt the READ on bank n, CL later (see Figure 10 on
page 23).
charge), the WRITE to bank m will interrupt the READ on bank n when registered (see
Figures 12 and 13 on page 25). DQM should be used one clock prior to the WRITE command
to prevent bus contention.
charge), the READ to bank m will interrupt the WRITE on bank n when registered (see
Figure 20 on page 30), with the data-out appearing CL later. The last valid WRITE to bank n
will be data-in registered one clock prior to the READ to bank m.
charge), the WRITE to bank will interrupt the WRITE on bank n when registered (see
Figure 18 on page 29). The last valid WRITE to bank n will be data-in registered one clock
prior to the READ to bank m.
the READ to bank m will interrupt the READ on bank n, CL later. The PRECHARGE to bank n
will begin when the READ to bank m is registered (see Figure 27 on page 35).
the WRITE to bank m will interrupt the READ on bank n when registered. DQM should be
used two clocks prior to the WRITE command to prevent bus contention. The PRECHARGE
to bank n will begin when the WRITE to bank m is registered (see Figure 28 on page 35).
the READ to bank m will interrupt the WRITE on bank n when registered, with the data-out
appearing CL later. The PRECHARGE to bank n will begin after
begins when the READ to bank m is registered. The last valid WRITE bank n will be data-in
registered one clock prior to the READ to bank m (see Figure 29 on page 36).
the WRITE to bank m will interrupt the WRITE on bank n when registered. The PRECHARGE
to bank n will begin after
istered. The last valid WRITE to bank n will be data registered one clock to the WRITE to
bank m (see Figure 30 on page 36).
t
WR is met, where
41
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
WR begins when the WRITE to bank m is reg-
t
WR is met, where
©2001 Micron Technology, Inc. All rights reserved.
128Mb: x32 SDRAM
Register Definition
t
WR

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