MT48LC4M32B2P-6:G Micron Technology Inc, MT48LC4M32B2P-6:G Datasheet - Page 51

IC SDRAM 128MBIT 167MHZ 86TSOP

MT48LC4M32B2P-6:G

Manufacturer Part Number
MT48LC4M32B2P-6:G
Description
IC SDRAM 128MBIT 167MHZ 86TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC4M32B2P-6:G

Package / Case
86-TSOPII
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
128M (4Mx32)
Speed
167MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Access Time
RoHS Compliant
Memory Case Style
TSOP
No. Of Pins
86
Operating Temperature Range
0°C To +70°C
Operating Temperature Max
70°C
Operating Temperature Min
0°C
Organization
4Mx32
Density
128Mb
Address Bus
14b
Access Time (max)
17/7.5/5.5ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
195mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Memory Configuration
4 BLK (1M X 32)
Interface Type
LVTTL
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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MT48LC4M32B2P-6:G
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Figure 34:
PDF: 09005aef80872800/Source: 09005aef80863355
128MbSDRAMx32_2.fm - Rev. L 1/09 EN
COMMAND
A0-A9, A11
Precharge all
BA0, BA1
DQM 0-3
active banks
CLK
CKE
A10
DQ
Power-Down Mode
t CMS
High-Z
t CKS
t AS
SINGLE BANK
PRECHARGE
ALL BANKS
BANK(S)
Notes:
T0
t CMH
t CKH
t AH
Two clock cycles
1. Violating refresh requirements during power-down may result in a loss of data.
All banks idle, enter
power-down mode
t CK
T1
NOP
t CKS
t CL
T2
NOP
Input buffers gated off while in
power-down mode
t CH
51
Exit power-down mode
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Micron Technology, Inc., reserves the right to change products or specifications without notice.
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t CKS
Tn + 1
NOP
All banks idle
©2001 Micron Technology, Inc. All rights reserved.
128Mb: x32 SDRAM
Timing Diagrams
Tn + 2
ACTIVE
ROW
ROW
BANK
DON’T CARE
UNDEFINED

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